Thick Negative Epoxy Photoresists
Permanent Applications
MATERIAL ATTRIBUTES
- i-line imaging
- High aspect ratio with vertical sidewalls
- Photo-definable ultra-thick structures
- Outstanding chemical and thermal stability
- Excellent dry-etch resistance
- Film thickness from 2 -> 200 µm with single spin coat processes
APPLICATIONS
- MEMS
- PDMS molding
- Microfluidics
- Inkjet nozzles