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SU-8 series
Negative Photoresists
Element 25weqwf
Thick Negative Epoxy Photoresists
Permanent Applications, High aspect ratio, photo-definable ultra-thick structures, Wide range of viscosities – 10-200 µm optimum thickness range
MATERIAL ATTRIBUTES
  • i-line imaging
  • High aspect ratio with vertical sidewalls
  • Photo-definable ultra-thick structures
  • Wide range of viscosities – 10-200 um optimum thickness range
  • Outstanding chemical and thermal stability
  • Excellent dry-etch resistance
  • Film thickness from 2 -> 200 µm with single spin coat processes
APPLICATIONS
  • MEMS
  • PDMS molding
  • Microfluidics
  • Inkjet nozzles

quotation request

Clear
SU-8 2000 series
Negative Photoresists
Element 25weqwf
Thick Negative Epoxy Photoresists
Permanent Applications
MATERIAL ATTRIBUTES
  • i-line imaging
  • High aspect ratio with vertical sidewalls
  • 0.5 -> 200 µm film thickness in a single coat
  • Improved substrate wetting
  • Faster drying and higher process throughput
  • Wide range of viscosities – 10-100 um optimum thickness range
  • Outstanding chemical and thermal stability
APPLICATIONS
  • MEMS
  • PDMS molding
  • Displays
  • Rapid prototyping

quotation request

Clear
SU-8 3000 series
Negative Photoresists
Element 25weqwf
Thick Negative Epoxy Photoresists
Permanent Applications
MATERIAL ATTRIBUTES
  • i-line imaging
  • High aspect ratio with vertical sidewalls
  • Up to 100 µm film thickness in a single coat
  • Improved substrate adhesion
  • Reduced coating stress
  • Wide range of viscosities – 10-70 um optimum thickness range
  • Outstanding chemical and thermal stability
APPLICATIONS
  • MEMS
  • PDMS molding
  • Waveguides
  • Microfluidics

quotation request

Clear
SU-8 TF 6000 series
Negative Photoresists
Element 25weqwf
High Resolution Thin Negative Epoxy Photoresist
Permanent Applications
MATERIAL ATTRIBUTES
  • Photo-imageable thin films with high resolution i-line patterning capability
  • Broadband, i-line, g-line and h-line sensitivity
  • 0.5 to > 10µm film thickness
  • High uniform coatings
  • Low temperature cure (< 150°C)
  • Outstanding chemical and thermal stability
APPLICATIONS
  • High resolution imaging of thin permanent structures
  • MEMS
  • Display pixel walls and dielectric layers

quotation request

Clear
KMPR® 1000 series
Negative Photoresists
Element 25weqwf
Permanent and Temporary Applications
MATERIAL ATTRIBUTES
  • High aspect ratio with vertical sidewalls
  • > 100 µm film thickness in a single coat
  • Good adhesion to most substrates
  • Alkaline development
  • Strippable with wet or dry chemistry
  • Wide range of viscosities – 4-75 um optimum thickness range
  • Excellent dry etch resistance

quotation request

Clear
PermiNex® 1000 series
Negative Photoresists
Element 25weqwf
Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications
MATERIAL ATTRIBUTES
  • Negative tone, photoimageable resists
  • Solvent development with PN 1000 Developer
  • i-line imaging, up to 3:1 aspect ratio
  • Low temperature processing (<200°C)
  • High quality, void free bonding
  • Excellent adhesion to silicon and glass
APPLICATIONS
  • Definition an capping of cavity structures
  • BAW and SAW devices
  • MEMS, MOEMS, microfluidics devices

quotation request

Clear
PermiNex® 2000 series
Negative Photoresists
Element 25weqwf
Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications
MATERIAL ATTRIBUTES
  • Negative tone, photoimageable resists
  • Alkaline development with standard TMAH Developer
  • i-line imaging, up to 3:1 aspect ratio
  • Low temperature processing (<200°C)
  • High quality, void free bonding
  • Excellent adhesion to silicon and glass
APPLICATIONS
  • Definition an capping of cavity structures
  • BAW and SAW devices
  • MEMS, MOEMS, microfluidics devices

quotation request

Clear
KMSF® 1000
Dielectric Materials
Element 25weqwf
Low Stress Dielectric Photoresist
MATERIAL ATTRIBUTES
  • Negative tone, photoimageable dielectric
  • No warpage due to low shrinkage and tensile modulus
  • Solvent developable
  • i-line/broadband sensitivity, 1:1 aspect ratio imaging
  • Low temperature processing (<200°C)
  • Good electrical properties
  • High thermal and chemical stability
  • Low moisture uptake

quotation request

Clear
PMMA / Copolymer series
Positive Photoresists
Element 25weqwf
PMMA/Co-polymers Positive Resists E-Beam Processing
MATERIAL ATTRIBUTES
  • E-beam and X-ray imageable
  • High resolution
  • Wide range of film thicknesses
  • Excellent adhesion to most substrates
APPLICATIONS
  • Direct-write e-beam lithography
  • T-gates
  • Temporary bonding adhesive
  • Protective coating
  • Metal lift-off

quotation request

Clear
LOR / PMGI series
Element 25weqwf
Resists for Bi-layer Lift-off Processing
MATERIAL ATTRIBUTES
  • No intermixing when over-coated with most top imaging resists
  • Single step development of bi-layer stack in TMAH or KOH developers
  • Quick and clean removal in conventional resist strippers
  • High resolution metallization (< 0.25 μm)
  • Very thick metallization (> 4 μm)
APPLICATIONS
  • Data storage
  • III-V semiconductors
  • Optoelectronics
  • MEMS

quotation request

Clear

If necessary, please also use the general contact on our website – we will get back to you as soon as possible!

Element 32
0

Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices

Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays

Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy

Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics

Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.