Thick Negative Epoxy Photoresists
Permanent Applications, High aspect ratio, photo-definable ultra-thick structures, Wide range of viscosities – 10-200 µm optimum thickness range
MATERIAL ATTRIBUTES
- i-line imaging
- High aspect ratio with vertical sidewalls
- Photo-definable ultra-thick structures
- Wide range of viscosities – 10-200 um optimum thickness range
- Outstanding chemical and thermal stability
- Excellent dry-etch resistance
- Film thickness from 2 -> 200 µm with single spin coat processes
APPLICATIONS
- MEMS
- PDMS molding
- Microfluidics
- Inkjet nozzles