Element 2
+49 30 641 670 100
Element 1
info@microresist.de

Unique Features

  • Excellent curing properties, even under air (presence of oxygen)
  • Compatibility to PDMS working stamps for soft-NIL, preferably applied in combination with UV-PDMS KER-4690 
  • Outstanding dry etch stability against various substrates like silicon, quartz, or aluminum
  • Purely organic resist, residue-free removable with oxygen plasma possible after curing

Applications

  • Etch mask for pattern transfer processes (dry and wet etching)
  • Fabrication of nanostructures for
    • LEDs, photonic crystals
    • Patterned sapphire substrates (PSS)
    • Microelectronics
    • Organic electronics (OLED, OPV, OTFT)
    • Data storage (bit patterned media)
    • Lift-off applications in combination with  e.g. LOR (MCC, USA)
mr-NIL210 is a purely organic, photo-curable NIL resist with oustanding dry etch characteristics. It features an excellent curing and nanoimprint performance and is particularly suitable for soft-NIL using soft stamp materials, e.g. PDMS.
Photo-curable NIL-Resist

Recommended process parameters

Process step Process parameter
Spin coating 3000 rpm for 30 s
Prebake 60 °C for 180 s
Imprint temperature Room temperature
Imprint pressure > 100 mbar
Radiation intensity mr-NIL210-100nm: 100 mW cm-2
mr-NIL210-200nm: 50 mW cm-2
mr-NIL210-500nm: 50 mW cm-2
Radiation source Option 1: broad band
Option 2: LED (365-405 nm)
Thinner mr-T 1078
Primer mr-APS1
Omnicoat (Kayaku Advanced Materials)
Recommended process chemicals:
Thinner mr-T 1078
Primer mr-APS1

Omnicoat (Kayaku Advanced Materials)

quotation request

Clear

New Organic Photo-Curable Nanoimprint Resist «mr-NIL210» for High Volume Fabrication Applying Soft PDMS-Based Stamps
M Messerschmidt et al., Journal of Photopolymer Science and Technology, Volume 30, Number 5 (2017) 6 0 5 -6 1 1
Link: https://www.jstage.jst.go.jp/article/photopolymer/30/5/30_605/_article/-char/en

UV-NIL based nanostructuring of aluminum using a novel organic imprint resist demonstrated for 100 nm half-pitch wire grid polarizer
F Schlachter et al., Microelectronic Engineering Volume 155, 2 April 2016, Pages 118-121
https://www.sciencedirect.com/science/article/abs/pii/S0167931716301587

Nanoindentation of crystalline silicon pillars fabricated by soft UV nanoimprint lithography and cryogenic deep reactive ion etching
G Hamdana et al., Sensors and Actuators A: Physical Volume 283, 1 November 2018, Pages 65-78
Link: https://www.sciencedirect.com/science/article/abs/pii/S092442471830102X

Negativresist, Dry resists
Easy Application of dry films resist
Dry film resists allow the easy manufacture of resist films in a broad variety of thicknesses. This “How-to-use” video demonstrates the easy handling of dry resist films.
Dry film resists
negative resists
UV lithography
ADEX
SUEX
MX 5000
WBR 2000
MX 5000
micro fluidics
2D/ 2.5 micro patterns
pattern transfer processes
electroplating
permanent application
22.01.2024
Hybridpolymere
Auswahl3 HY100 auf PC Folie mit 7x7cm pillars
New Prototypes in Hybrid Polymers
Poly- and perfluorinated compounds have become notorious under the name “PFAS” in recent years peaking in a draft submitted to the ECHA (European chemistry agency) earlier this year to check for a comprehensive ban of fluorinated compounds.
Hybridpolymere
OrmoStamp®FF
OrmoStamp®
PFAS
UV-Replication
Inkjet Printing
InkOrmo
InkOrmoPRO
OrmoComp®
dispensing
Mikrooptiken
29.11.2023
Negativresist
b1
Lithography services: Fabrication of masters for microfluidics
As part of our lithography services we provide since 2013 multi-layer master wafers for micro fluidic applications made of epoxy based resists...
Microfluidics
Negative resists
UV-Lithography
Lithography service
Soft lithography
Negativresist, Negative Photoresists
b1
Combined UV & e-beam lithography patterning in a mix & match approach in negative resists
The ongoing miniaturization of integrated circuits (IC‘s) and micro-electro-mechanical systems (MEMS) demands the fabrication of increasingly small and complex patterns with requirements for precision and resolution down to the nanometer scale.
Negative resists
UV Lithography
E-Beam lithography
Nano and Micro electronic
Dry etching
ma-N 1400
22. May 2023
Negativresist, Negative Photoresists, Trockenresiste, Dry resists
Trockenfilm_Techblog
Patterning of dry film resists in single or multilayer coatings
Dry film resists allow the easy manufacture of resist films in a broad variety of thicknesses.
Dry resists
Negative resists
UV lithography
Pattern transfer processes
2D/ 2.5D micro patterns
Micro fluidic
Permanent application
Electroplating
Nanoimprint
beideWafer2
The beauties of Nanoimprint Lithography 2022
As 2022 draws to a close, we proudly highlight a major achievement that our nanoimprint lithography (NIL) group has accomplished this year in collaboration with two key players in the European NIL ecosystem.
Nanoimprint Resist
Nanoimprint Lithography
mr-NIL212FC
UV-NIL
Dry Etch Mask
SMILE Technology
SmartNIL Technology
19.12.2022

Contact us:

Fields marked with an * are required.
Element 32
0

Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.

Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics

Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy

Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays

Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices