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MICROPOSIT S1800 G2 series photoresist are positive photoresist systems engineered to satisfy the microelectronics industry’s requirements for IC device fabrication. The system has been engineered using a toxico- logically – safer alternative casting solvent to the ethylene glycol derived ether acetates.
MEGAPOSITSPR220i-linephoto- resist is an optimized general-pur- pose, multi-wavelength resist designed to cover a wide range of film thicknesses, 1-30 μm, with a single-coat process. MEGAPOSITSPR220photoresistalsohas excellent adhesion and plating characteri- stics, which make it ideal for such thick film applications as MEMS and bump process.
MEGAPOSIT SPR3012/ 3510/3600
Series Photoresist are positive photoresist engineered for i-line, g-line and broadbandapplication while providing high- through- put and excellent lithographic performance.
MEGAPOSITSPR700seriesphotoresists are positive multiwavelength photoresists that are optimized to provide robust process latitudes and high throughput with excellent thermal stability. SPR700 resists are com- patible across a wide variety of developer families. This versatility makes SPR700 pho- toresists ideal for a number of applications, especially mix and match lithography.
SPR660 series is an advanced i-line photo- resist designed for processing 0.350 micron features and larger. SPR660 performs in both line / space and contact hole applica- tion and on variety of substrates, including silicon dioxide, titanium nitride, and organic anti-reflectant coatings. The SPR660 product family includes a range of undyed dilutions as well dye loadings for improved processing over reflective surface.
MEGAPOSITSPR955-CMseriesphoto- resist is a general purpose, high – through- put, i-line photoresist for 0.35 μmfront-end and back-end applications.SPR955-CM is optimized for anti-reflective (organic and inorganic) coating.
ULTRA-i™-123 is an advanced, general-purpose, 250 nm critical i-line photoresist with extendibility to 230 nm and below.
Microposit LOL 2000 lift-off layer is an enhanced dissolution rate, dyed PMGI (polyme- thylglutarimide) solution used for lift-off processes requiring tight CD control, such as GMR thinfilm head, GaAs, and other leading-edge semiconductor applications. The LOL bilayer lift-off process is suitable for applications where a thin layer of metal is sputtered or evaporated in an addi- tive process. CD variation due to etch bias inherent in substractive processes is eliminated, resulting in superiormetallinewidthcontrol.Attackonthe substrates by an etchant is eliminated.
UV26 is a positive DUV photoresist developed for deep Implant applications. The low viscosity of UV26 allows for redu- ced dispense volume and improved coating. Uniformity for film ranging from 0.7 μm to 3.0 μm. UV26G is the long term “green” replacement of UV26
UV5 positive DUV photo resist has been optimized to provide vertical profile imaging of isolated and semidense features for device production design rules to 150nm.
UV60 is a positive DUV photoresist designed for consolidation of implant, metal contact hole and via applications for 200 nm features. UV60 works well on reflective substrates.
UV210GS is a multipurpose resist that can be utilized for gate, phase shift mask contact holes and trench applications in 180 – 130 nm CD range.
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Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography
Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography
micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.
OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436
Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.
micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.
Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!
Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process
Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.
micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.
DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)
We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.
Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)
We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.
DJ MicroLaminates, Inc.
We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.