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EpoCore & EpoClad series
Negative Photoresists
micro resist technology

Contact Person

3800
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for UV lithography
Low optical loss permanent application
Unique Features
  • Standard UV lithography and PCB technology
  • High transmittance @ 850 nm
  • Optical loss ~ 0.2 dB/cm @ 850 nm
  • High heat and pressure resistance
  • Tunable refractive index (core/ cladding)
Applications
  • Optical polymer multimode (MM) and single mode (SM) waveguides:
  •  EpoCore as core and EpoClad as cladding material

EpoCore

Product Film thickness
EpoCore 2 2.0 µm @ 3000 rpm
EpoCore 5 5.0 µm @ 3000 rpm
EpoCore 10 10 µm @ 3000 rpm
EpoCore 20 20 µm @ 3000 rpm
EpoCore 50 50 µm @ 1500 rpm

EpoClad

Product Film thickness
EpoClad 2 2.0 µm @ 3000 rpm
EpoClad 5 5.0 µm @ 3000rpm
EpoClad 10 10 µm @ 3000rpm
EpoClad 20 20 µm @ 3000rpm
EpoClad 50 50 µm @ 1700 rpm
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mr-DWL series
Negative Photoresists
micro resist technology

Contact Person

3800
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resists for direct laser writing @ 405 nm
Permanent application and conventional pattern transfer processes
Unique Features
  • Sensitive above 400 nm, for direct writing laser @ 405 nm
  • High thermal and chemical stability
  • High wet and dry etch stability
Applications
  • Fast and contactless prototyping by
  • Permanent: Master/ template manufacture, mould for PDMS
  • Pattern transfer: Etch mask, mould for electroplating
Parameter
Resist Film tickness
mr-DWL 5 5.0 µm @ 3000 rpm
mr-DWL 40 40 µm @ 2000 rpm
mr-DWL 100 100 µm @ 1500 rpm

 

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mr-EBL 6000 series
Negative Photoresists
micro resist technology

Contact Person

3800
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for e-beam lithography
Conventional pattern transfer processes
Unique Features mr-EBL 6000 series for e-beam lithography
  • Excellent thermal stability of the resist patterns
  • High wet and dry etch resistance
  • High resolution capability (~ 40 - 50 nm)
  • Post exposure bake (PEB) required
  • Mask for etching

mr-EBL 6000

Resist Film thickness @ 3000 rpm
mr-EBL 6000.1 0.1 µm
mr-EBL 6000.3 0.3 µm
mr-EBL 6000.5 0.5 µm
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ma-N 2400 series
Negative Photoresists
micro resist technology

Contact Person

3800
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for e-beam lithography
Conventional pattern transfer processes
Unique Features ma-N 2400 series for e-beam and deep UV lithography
  • High resolution capability (~ 40 - 50 nm)
  • Aqueous alkaline development
  • Good thermal stability of the resist patterns
  • High wet and dry etch resistance
  • Easy to remove
Applications
  • Mask for etching

ma-N 2400

Resist Film thickness @ 3000 rpm
ma-N 2401 0.1 µm
ma-N 2403 0.3 µm
ma-N 2405 0.5 µm
ma-N 2410 1.0 µm
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ma-N 1400 series
Negative Photoresists
micro resist technology

Contact Person

3800
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for UV lithography
Single layer lift-off application, conventional pattern transfer processes
Unique Features
  • Tunable pattern profile: vertical to undercut
  • Good thermal stability of the resist pattern
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

 

ma-N 400: Thermal stability up to 110°C for metal evaporation

  • Mask for lift-off processes
  • Etch mask for semiconductors and metals
  • Mask for ion implantation

ma-N 1400

Resist Film thickness @ 3000 rpm
ma-N 1405 0.5 µm
ma-N 1407 0.7 µm
ma-N 1410 1.0 µm
ma-N 1420 2.0 µm
ma-N 1440 4.0 µm
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ma-N 400 series
Negative Photoresists
micro resist technology

Contact Person

3800
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for UV lithography
Single layer lift-off application, conventional pattern transfer processes
Unique Features
  • Tunable pattern profile: vertical to undercut
  • Good thermal stability of the resist pattern
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

 

ma-N 400: Thermal stability up to 110°C for metal evaporation

Application
  • Mask for lift-off processes
  • Etch mask for semiconductors and metals
  • Mask for ion implantation

ma-N 400

Resist Film thickness @ 3000 rpm
ma-N 405 0.5 µm
ma-N 415 1.5 µm
ma-N 420 2.0 µm
ma-N 440 4.1 µm
ma-N 490 7.5 µm
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ma-P 1200 series / ma-P 1275HV
Positive Photoresists
micro resist technology

Contact Person

Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Positive Photoresist Series and Thick Film Photoresists for UV lithography
ma-P 1200 series and ma-P 1275 & ma-P 1275HV for microsystems technology and microelectronics
Unique Features

• Film thickness up to 60 μm in one spin-coating step
• Broadband-, g- and i-line exposure
• High stability in acid and alkaline plating baths
• High dry and wet etch resistance
• Good thermal stability of the resist patterns attainable
• Aqueous alkaline development
• Side wall angle up to 87° with mask aligner broadband exposure
• Suitable for pattern reflow

Applications

• Etch mask - metals and semiconductors
• Mould for electroplating
• Fabrication of micro optical components, e.g. micro lenses by pattern transfer from reflowed resist patterns
• Mask for ion implantation

Resist Film Thickness @ 3000 rpm
ma-P 1205 0,5 µm
ma-P 1210 1,0 µm
ma-P 1215 1,5 µm
ma-P 1225 2,5 µm
ma-P 1240 4,0 µm
ma-P 1275 7,5 µm
ma-P 1275HV 11,0 µm
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mr-P 1200LIL series
Positive Photoresists
micro resist technology

Contact Person

Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photoresist series for UV lithography
mr-P 1200LIL is a series of thin positive tone photoresists for high resolution applications. It is excellently suited for laserinterference lithography (LIL).
Unique Features
  • 100…500 nm film thickness
  • Sensitive to 350…450 nm exposure
  • Steep sidewalls due to high contrast enable high quality etched patterns
  • Aqueous alkaline development
  • Etch resistant
Applications

Masking of substrate surfaces during fabrication of steep-edged nano structures for diffractive optics:

  • Laminary gratings
  • VLS gratings
Resist Film thickness @ 3000 rpm
mr-P 1201LIL 0.1 µm
mr-P 1202LIL 0.2 µm
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ma-P 1200G series
Positive Photoresists
micro resist technology

Contact Person

Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photoresist series for greyscale lithography
ma-P 1200G is a positive tone photoresist series specifically designed for the requirements of greyscale lithography. Standard binary lithography is also possible.
Unique Features
  • Reduced contrast
  • Film thickness up to 60 µm and higher
  • 50-60 µm depth range of the patterns possible in greyscale lithography
  • Spectral sensitivity 350…450 nm
  • High intensity laser exposure possible without outgassing
  • Aqueous alkaline development, for greyscale lithography with TMAH based developers, for standard binary lithography also with metal ion bearing developers
  • Suitable for electroplating
  • Suitable for dry etch processes e.g. with CHF3, CF4, SF6
  • Suitable for pattern reflow after standard binary lithography
Applications

Use of manufactured 3D patterns in micro-optics, MEMS and MOEMS, displays

Pattern transfer by

  • UV moulding
  • Etching
  • Electroplating
Resist Film thickness @ 3000 rpm
ma-P 1215G 1.5 µm
ma-P 1225G 2.5 µm
ma-P 1275G 9.5 µm
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mr-PosEBR series
Positive Photoresists
micro resist technology

Contact Person

Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Positive resist series for e-beam lithography
Unique Features
  • Highly sensitive
  • High resolution capability (< 50 nm)
  • Excellent dry etch resistance
  • Development in organic solvents
Applications
  • Etch mask
Resist Film tickness @ 3000 rpm
mr-PosEBR 0.05 50 nm
mr-PosEBR 0.1 100 nm
mr-PosEBR 0.3 300 nm
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OrmoStamp®
Hybrid Polymers
micro resist technology

Contact Person

3806
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV-based and thermal imprinting
OrmoStamp® offers glass-like properties after UV curing and was designed for the fabrication of transparent polymer working stamps with excellent pattern fidelity
Unique Features
  • Highly transparent for near UV and visible light
  • High thermal and mechanical stability
  • Enhanced anti-adhesive properties for low release forces
  • Processing with standard lithography equipment
Applications
  • Transparent working stamp fabrication
  • Cost efficient alternative to quartz stamps
  • UV-based and thermal imprinting, nanoimprint lithography
Parameter OrmoStamp®
Viscosity 0.4 +/– 0.2 Pa•s
Resolution, pattern replication Excellent pattern replication
Thermal stability Up to 270 °C (short term)
Refractive index (589 nm, cured) 1.516
Replication with PDMS molds
(no oxygen sensitivity)		 Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solution
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OrmoCore and OrmoClad
Hybrid Polymers
micro resist technology

Contact Person

3806
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint, UV moulding, and UV lithography
OrmoCore and OrmoClad offer glass-like material properties after UV curing and are due to their low optcal loss particulary suitable for optical waveguide fabrication
Unique Features
  • Low optical loss at datacom wavelengths
  • Tunable refractive index (Core/Clad ratios)
  • High thermal and mechanical stability
Applications
  • Single-mode and multi-mode waveguides
  • Beam splitters
  • Thermo-optical switches
  • Microring resonators
OrmoCore OrmoClad
Viscosity 2.9 +/- 0.4 Pa•s 2.5 +/- 1 Pa•s
Resolution Down to 100 nm feature sizes Down to 100 nm feature sizes
Thermal stability Up to 270 °C (short term) Up to 270 °C (short term)
Refractive index
(589 nm, cured)		 1.555 1.537
Replication with PDMS molds
(no oxygen sensitivity)		 No No
Shelf-life 6 months 6 months
Solvent-free Yes, ready-to-use solutions Yes, ready-to-use solutions
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OrmoComp®
Hybrid Polymers
micro resist technology

Contact Person

3806
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint and UV mouldling
OrmoComp® offers glass-like material properties after UV curing and is the standard product for a broad range of pattern sizes and component dimensions
Unique Features
  • Highly transparent for near UV and VIS down to 350 nm
  • High thermal and mechanical stability
Applications
  • Moulded gratings and prisms
  • Micro lenses and micro lens arrays
  • Optical couplers and connectors
  • Microfluidic systems
  • Single elements or wafer scale
Parameter OrmoComp® OrmoClear®FX
Viscosity 2 ± 0.5 Pa•s 1.5 +/- 0.3 Pa•s
Resolution Down to 100 nm feature sizes
Thermal stability Up to 270 °C (short term)
Volume shrinkage 5 – 7 % 3 – 5 %
Refractive index (589 nm, cured) 1.520 1.555
Replication with PDMS molds
(no oxygen sensitivity)		 Yes Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solutions
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OrmoClear® series
Hybrid Polymers
micro resist technology

Contact Person

3806
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint and UV mouldling
The OrmoClear® series offers glass-like material properties after UV curing and due to its very low volume shrinkage during UV exposure it is suitable for components of dimensions > 100 µm
Unique Features
  • Highly transparent for near UV and VIS down to 350 nm
  • High thermal and mechanical stability
Applications
  • Moulded gratings and prisms
  • Micro lenses and micro lens arrays
  • Optical couplers and connectors
  • Microfluidic systems
  • Single elements or wafer scale
Parameter OrmoClear® OrmoClear®30 OrmoClear®FX
Viscosity 2.9 ± 0.3 Pa•s 30 ± 3 Pa•s 1.5 ± 0.3 Pa•s
Resolution Down to 100 nm feature sizes
Volume shrinkage 3 - 5 % << 2 % 3 - 5 %
Thermal stability Up to 270 °C (short term)
Refractive index
(589 nm, cured)		 1.555 1.561 1.555
Replication with PDMS molds
(no oxygen sensitivity)		 No No Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solutions
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OrmoClear®FX
Hybrid Polymers
micro resist technology

Contact Person

3806
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint and UV moulding
OrmoClear®FX offers glass-like material properties after UV curing. It is optimized for micro- and nanooptical components of different pattern sizes and dimensions.
Unique Features
  • Highly transparent for near UV and VIS down to 350 nm
  • High thermal and mechanical stability
Applications
  • Moulded gratings and prisms
  • Micro lenses and micro lens arrays
  • Optical couplers and connectors
  • Microfluidic systems
  • Single elements or wafer scale
Parameter OrmoClear®FX OrmoComp®
Viscosity 1.5 +/- 0.3 Pa•s 2 ± 0.5 Pa•s
Resolution Down to 100 nm feature sizes
Thermal stability Up to 270 °C (short term)
Volume shrinkage 3 – 5 % 5 – 7 %
Refractive index (589 nm, cured) 1.555 1.520
Replication with PDMS molds
(no oxygen sensitivity)		 Yes Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solutions
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mr-NIL200 series
Nanoimprint Resists
micro resist technology

Contact Person

3808
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable NIL resist
mr-NIL200 is a photo-curable NIL resist specifically for applying hard and non-permeable stamp materials. The typical application field of mr-NIL200 is the use as an etch mask in pattern transfer processes for e.g. photonic applications. mr-NIL200 works without the need for any additional adhesion promoter or primer.
Unique Features
  • No need for additional adhesion promoter or primer proved on different substrates (Si, SiO2, Al, sapphire, Cu, different underlayer materials like LOR, UL1, UL3)
  • Can be cured under ambient conditions in the presence of air
  • Low viscosity renders fast cavitity filling and minimize propensity for air bubble defects
Application Examples

Step-and-repeat nanoimprint on pre-spin coated film for the fabrication of integrated optical devices
G Calafiore et al., J. Micro/Nanolith. MEMS MOEMS 14(3), 033506 Link to Abstract

Efficient fabrication of photonic and optical patterns by imprinting the tailored photo-curable NIL resist «mr-NIL200»
M Messerschmidt et al., Poster, International Conference on Micro & Nano Engineering MNE2018, Copenhagen Link to Poster

 Recommended process parameters

Process step Process parameter
Spin coating 3000 rpm for 30 s
Prebake 60 °C for 180 s
Imprint temperature Room temperature
Imprint pressure > 100 mbar
Exposure dose > 1J cm-2
Radiation source Option 1: broad band
Option 2: LED (365-405 nm)
Thinner mr-T 1078
Primer Not needed
(mr-APS1 for mr-NIL200 film thickness > 300nm)

 Film thickness and package size

Specifications Film thickness and package sizes
Ready to use solutions for standard film thickness (3000 rpm) mr-NIL200-100 nm
mr-NIL200-200 nm
mr-NIL200-300 nm
Customized film thickness upon request between (3000 rpm) 1 µm
Availalbe resist quantities 250 ml
500 ml
Larger volumes on request
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mr-XNIL26SF
Nanoimprint Resists
micro resist technology

Contact Person

3808
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable NIL resist, solvent-free
Photo-curable NIL resist featuring high content of fluorinated components
Unique Features
  • high content of fluorinated components for easy stamp release and low defectivity
  • 100% organic, easy strippable with oxygen plasma
  • Can be diluted to 100nm film thickness using PGMEA or ma-T 1050
Applications
  • NIL applications where comparably low release forces are essential (e.g. imprints on top of a multilayer stack)
mr-XNIL26 version Film thickness
mr-XNIL26SF 4.8 µm
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mr-NIL210 series
Nanoimprint Resists
micro resist technology

Contact Person

3808
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable NIL-Resist
mr-NIL210 is a purely organic, photo-curable NIL resist with oustanding dry etch characteristics. It features an excellent curing and nanoimprint performance and is particularly suitable for soft-NIL using soft stamp materials, e.g. PDMS.
Unique Features
  • Excellent curing properties, even under air (presence of oxygen)
  • Compatibility to PDMS working stamps for soft-NIL, preferably applied in combination with UV-PDMS KER-4690 
  • Outstanding dry etch stability against various substrates like silicon, quartz, or aluminum
  • Purely organic resist, residue-free removable with oxygen plasma possible after curing
Applications
  • Etch mask for pattern transfer processes (dry and wet etching)
  • Fabrication of nanostructures for
    • LEDs, photonic crystals
    • Patterned sapphire substrates (PSS)
    • Microelectronics
    • Organic electronics (OLED, OPV, OTFT)
    • Data storage (bit patterned media)
    • Lift-off applications in combination with  e.g. LOR (MCC, USA)

Recommended process parameters

Process step Process parameter
Spin coating 3000 rpm for 30 s
Prebake 60 °C for 180 s
Imprint temperature Room temperature
Imprint pressure > 100 mbar
Radiation intensity mr-NIL210-100nm: 100 mW cm-2
mr-NIL210-200nm: 50 mW cm-2
mr-NIL210-500nm: 50 mW cm-2
Radiation source Option 1: broad band
Option 2: LED (365-405 nm)
Thinner ma-T 1078
Primer mr-APS1

 

 Our available standard film thicknesses

mr-NIL210 version Film thickness @3000 rpm*
mr-NIL210-100nm 100 nm
mr-NIL210-200nm 200 nm
mr-NIL210-500nm 500 nm

* Customized film thickness available on request up to 2 µm

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mr-NIL 6000E series
Nanoimprint Resists
micro resist technology

Contact Person

3808
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable thermoplastic NIL resist
mr-NIL 6000E is a photo-curable thermoplastic NIL resist featuring excellent pattern stability after imprinting and radiation in subsequent processes with a thermal load
Unique Features
  • Excellent thermal structure stability in subsequent processes due to the photochemically induced crosslinking reaction during imprinting
  • 100% organic NIL resist → dry etching and stripping possible with pure oxygen plasma
Applications
  • Fabrication of nanopatterns by pattern transfer for e.g.
  • High brightness LEDs
  • Photonic crystals
  • Patterned media
  • Nano-optical devices, subwavelength optical elements
mr-NIL 6000E version Film thickness *
mr-NIL 6000.1E 100 nm
mr-NIL 6000.2E 200 nm
mr-NIL 6000.3E 300 nm
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mr-I 9000M series
Nanoimprint Resists
micro resist technology

Contact Person

3808
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
3802
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Thermoset
Thermally curable NIL resist (Thermoset - no Tg after imprinting)
Unique Features
  • Excellent thermal structure stability (up to 250 °C in a two-step imprinting process) in subsequent processes due to the thermally induced crosslinking reaction during imprinting
  • 100% organic resist → dry etching and stripping possible with pure oxygen plasma
Applications

Fabrication of nanopatterns by pattern transfer for e.g.

  • High brightness LEDs
  • Photonic crystals
  • Patterned media
  • Nano-optical devices, subwavelength optical elements
mr-I 9000M version * Film thickness *
mr-I 9010M 100 nm
mr-I 9020M 200 nm
mr-I 9030M 300 nm
mr-I 9050M 500 nm
mr-I 9100M 1.0 µm

* Customized film thickness available on request

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Element 32
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Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices

Contact Person

Dr. Anja Voigt

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Element 23weqwf

Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays

Contact Person

Dr. Christine Schuster

E-Mail: c.schuster@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Element 23weqwf

Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

Contact Person

Dr. Jan Klein

E-Mail: j.klein@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

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Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

Contact Person

Dr. Manuel Thesen

E-Mail: m.thesen@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

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Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy

Contact Person

Dr. Anja Voigt

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Dr. Jan Klein

E-Mail: j.klein@microresist.de

Phone: +49 30 64 16 70 100

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Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics

Contact Person

Carsten Schröder

E-Mail: c.schroeder@microresist.de

Phone: +49 30 64 16 70 100

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Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.

Contact Person

Franziska Kopp

DuPont Electronics & Imaging Products

E-Mail: f.kopp@microresist.de

Phone: +49 30 64 16 70 100

Dr. Anja Voigt

Kayaku Advanced Materials, DJ Mikrolaminates

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

Kayaku Advanced Materials, DJ Mikrolaminates

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100