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EpoCore & EpoClad series
Negative Photoresists
micro resist technology
Contact Person
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for UV lithography
Low optical loss permanent application
Unique Features
  • Standard UV lithography and PCB technology
  • High transmittance @ 850 nm
  • Optical loss ~ 0.2 dB/cm @ 850 nm
  • High heat and pressure resistance
  • Tunable refractive index (core/ cladding)
Applications
  • Optical polymer multimode (MM) and single mode (SM) waveguides:
  •  EpoCore as core and EpoClad as cladding material

EpoCore

Product Film thickness
EpoCore 2 2.0 µm @ 3000 rpm
EpoCore 5 5.0 µm @ 3000 rpm
EpoCore 10 10 µm @ 3000 rpm
EpoCore 20 20 µm @ 3000 rpm
EpoCore 50 50 µm @ 1500 rpm

EpoClad

Product Film thickness
EpoClad 2 2.0 µm @ 3000 rpm
EpoClad 5 5.0 µm @ 3000rpm
EpoClad 10 10 µm @ 3000rpm
EpoClad 20 20 µm @ 3000rpm
EpoClad 50 50 µm @ 1700 rpm
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mr-DWL series
Negative Photoresists
micro resist technology
Contact Person
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resists for direct laser writing @ 405 nm
Permanent application and conventional pattern transfer processes
Unique Features
  • Sensitive above 400 nm, for direct writing laser @ 405 nm
  • High thermal and chemical stability
  • High wet and dry etch stability
Applications
  • Fast and contactless prototyping by
  • Permanent: Master/ template manufacture, mould for PDMS
  • Pattern transfer: Etch mask, mould for electroplating
Parameter
Resist Film tickness
mr-DWL 5 5.0 µm @ 3000 rpm
mr-DWL 40 40 µm @ 2000 rpm
mr-DWL 100 100 µm @ 1500 rpm

 

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mr-EBL 6000 series
Negative Photoresists
micro resist technology
Contact Person
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for e-beam lithography
Conventional pattern transfer processes
Unique Features mr-EBL 6000 series for e-beam lithography
  • Excellent thermal stability of the resist patterns
  • High wet and dry etch resistance
  • High resolution capability (~ 40 - 50 nm)
  • Post exposure bake (PEB) required
  • Mask for etching

mr-EBL 6000

Resist Film thickness @ 3000 rpm
mr-EBL 6000.1 0.1 µm
mr-EBL 6000.3 0.3 µm
mr-EBL 6000.5 0.5 µm
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ma-N 2400 series
Negative Photoresists
micro resist technology
Contact Person
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for e-beam lithography
Conventional pattern transfer processes
Unique Features ma-N 2400 series for e-beam and deep UV lithography
  • High resolution capability (~ 40 - 50 nm)
  • Aqueous alkaline development
  • Good thermal stability of the resist patterns
  • High wet and dry etch resistance
  • Easy to remove
Applications
  • Mask for etching

ma-N 2400

Resist Film thickness @ 3000 rpm
ma-N 2401 0.1 µm
ma-N 2403 0.3 µm
ma-N 2405 0.5 µm
ma-N 2410 1.0 µm
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ma-N 1400 series
Negative Photoresists
micro resist technology
Contact Person
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for UV lithography
Single layer lift-off application, conventional pattern transfer processes
Unique Features
  • Tunable pattern profile: vertical to undercut
  • Good thermal stability of the resist pattern
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

 

ma-N 400: Thermal stability up to 110°C for metal evaporation

  • Mask for lift-off processes
  • Etch mask for semiconductors and metals
  • Mask for ion implantation

ma-N 1400

Resist Film thickness @ 3000 rpm
ma-N 1405 0.5 µm
ma-N 1407 0.7 µm
ma-N 1410 1.0 µm
ma-N 1420 2.0 µm
ma-N 1440 4.0 µm
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ma-N 400 series
Negative Photoresists
micro resist technology
Contact Person
Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Negative resist series for UV lithography
Single layer lift-off application, conventional pattern transfer processes
Unique Features
  • Tunable pattern profile: vertical to undercut
  • Good thermal stability of the resist pattern
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

 

ma-N 400: Thermal stability up to 110°C for metal evaporation

Application
  • Mask for lift-off processes
  • Etch mask for semiconductors and metals
  • Mask for ion implantation

ma-N 400

Resist Film thickness @ 3000 rpm
ma-N 405 0.5 µm
ma-N 415 1.5 µm
ma-N 420 2.0 µm
ma-N 440 4.1 µm
ma-N 490 7.5 µm
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ma-P 1200 series / ma-P 1275HV
Positive Photoresists
micro resist technology
Contact Person
Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Positive Photoresist Series and Thick Film Photoresists for UV lithography
ma-P 1200 series and ma-P 1275 & ma-P 1275HV for microsystems technology and microelectronics
Unique Features

• Film thickness up to 60 μm in one spin-coating step
• Broadband-, g- and i-line exposure
• High stability in acid and alkaline plating baths
• High dry and wet etch resistance
• Good thermal stability of the resist patterns attainable
• Aqueous alkaline development
• Side wall angle up to 87° with mask aligner broadband exposure
• Suitable for pattern reflow

Applications

• Etch mask - metals and semiconductors
• Mould for electroplating
• Fabrication of micro optical components, e.g. micro lenses by pattern transfer from reflowed resist patterns
• Mask for ion implantation

Resist Film Thickness @ 3000 rpm
ma-P 1205 0,5 µm
ma-P 1210 1,0 µm
ma-P 1215 1,5 µm
ma-P 1225 2,5 µm
ma-P 1240 4,0 µm
ma-P 1275 7,5 µm
ma-P 1275HV 11,0 µm
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mr-P 1200LIL series
Positive Photoresists
micro resist technology
Contact Person
Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photoresist series for UV lithography
mr-P 1200LIL is a series of thin positive tone photoresists for high resolution applications. It is excellently suited for laserinterference lithography (LIL).
Unique Features
  • 100…500 nm film thickness
  • Sensitive to 350…450 nm exposure
  • Steep sidewalls due to high contrast enable high quality etched patterns
  • Aqueous alkaline development
  • Etch resistant
Applications

Masking of substrate surfaces during fabrication of steep-edged nano structures for diffractive optics:

  • Laminary gratings
  • VLS gratings
Resist Film thickness @ 3000 rpm
mr-P 1201LIL 0.1 µm
mr-P 1202LIL 0.2 µm
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ma-P 1200G series
Positive Photoresists
micro resist technology
Contact Person
Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photoresist series for greyscale lithography
ma-P 1200G is a positive tone photoresist series specifically designed for the requirements of greyscale lithography. Standard binary lithography is also possible.
Unique Features
  • Reduced contrast
  • Film thickness up to 60 µm and higher
  • 50-60 µm depth range of the patterns possible in greyscale lithography
  • Spectral sensitivity 350…450 nm
  • High intensity laser exposure possible without outgassing
  • Aqueous alkaline development, for greyscale lithography with TMAH based developers, for standard binary lithography also with metal ion bearing developers
  • Suitable for electroplating
  • Suitable for dry etch processes e.g. with CHF3, CF4, SF6
  • Suitable for pattern reflow after standard binary lithography
Applications

Use of manufactured 3D patterns in micro-optics, MEMS and MOEMS, displays

Pattern transfer by

  • UV moulding
  • Etching
  • Electroplating
Resist Film thickness @ 3000 rpm
ma-P 1215G 1.5 µm
ma-P 1225G 2.5 µm
ma-P 1275G 9.5 µm
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mr-PosEBR series
Positive Photoresists
micro resist technology
Contact Person
Christine Schuster
Mail: c.schuster@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Positive resist series for e-beam lithography
Unique Features
  • Highly sensitive
  • High resolution capability (< 50 nm)
  • Excellent dry etch resistance
  • Development in organic solvents
Applications
  • Etch mask
Resist Film tickness @ 3000 rpm
mr-PosEBR 0.05 50 nm
mr-PosEBR 0.1 100 nm
mr-PosEBR 0.3 300 nm
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OrmoStamp®
Hybrid Polymers
micro resist technology
Contact Person
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV-based and thermal imprinting
OrmoStamp® offers glass-like properties after UV curing and was designed for the fabrication of transparent polymer working stamps with excellent pattern fidelity
Unique Features
  • Highly transparent for near UV and visible light
  • High thermal and mechanical stability
  • Enhanced anti-adhesive properties for low release forces
  • Processing with standard lithography equipment
Applications
  • Transparent working stamp fabrication
  • Cost efficient alternative to quartz stamps
  • UV-based and thermal imprinting, nanoimprint lithography
Parameter OrmoStamp®
Viscosity 0.4 +/– 0.2 Pa•s
Resolution, pattern replication Excellent pattern replication
Thermal stability Up to 270 °C (short term)
Refractive index (589 nm, cured) 1.516
Replication with PDMS molds
(no oxygen sensitivity)		 Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solution
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OrmoCore and OrmoClad
Hybrid Polymers
micro resist technology
Contact Person
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint, UV moulding, and UV lithography
OrmoCore and OrmoClad offer glass-like material properties after UV curing and are due to their low optcal loss particulary suitable for optical waveguide fabrication
Unique Features
  • Low optical loss at datacom wavelengths
  • Tunable refractive index (Core/Clad ratios)
  • High thermal and mechanical stability
Applications
  • Single-mode and multi-mode waveguides
  • Beam splitters
  • Thermo-optical switches
  • Microring resonators
OrmoCore OrmoClad
Viscosity 2.9 +/- 0.4 Pa•s 2.5 +/- 1 Pa•s
Resolution Down to 100 nm feature sizes Down to 100 nm feature sizes
Thermal stability Up to 270 °C (short term) Up to 270 °C (short term)
Refractive index
(589 nm, cured)		 1.555 1.537
Replication with PDMS molds
(no oxygen sensitivity)		 No No
Shelf-life 6 months 6 months
Solvent-free Yes, ready-to-use solutions Yes, ready-to-use solutions
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OrmoComp®
Hybrid Polymers
micro resist technology
Contact Person
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint and UV mouldling
OrmoComp® offers glass-like material properties after UV curing and is the standard product for a broad range of pattern sizes and component dimensions
Unique Features
  • Highly transparent for near UV and VIS down to 350 nm
  • High thermal and mechanical stability
Applications
  • Moulded gratings and prisms
  • Micro lenses and micro lens arrays
  • Optical couplers and connectors
  • Microfluidic systems
  • Single elements or wafer scale
Parameter OrmoComp® OrmoClear®FX
Viscosity 2 ± 0.5 Pa•s 1.5 +/- 0.3 Pa•s
Resolution Down to 100 nm feature sizes
Thermal stability Up to 270 °C (short term)
Volume shrinkage 5 – 7 % 3 – 5 %
Refractive index (589 nm, cured) 1.520 1.555
Replication with PDMS molds
(no oxygen sensitivity)		 Yes Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solutions
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OrmoClear® series
Hybrid Polymers
micro resist technology
Contact Person
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint and UV mouldling
The OrmoClear® series offers glass-like material properties after UV curing and due to its very low volume shrinkage during UV exposure it is suitable for components of dimensions > 100 µm
Unique Features
  • Highly transparent for near UV and VIS down to 350 nm
  • High thermal and mechanical stability
Applications
  • Moulded gratings and prisms
  • Micro lenses and micro lens arrays
  • Optical couplers and connectors
  • Microfluidic systems
  • Single elements or wafer scale
Parameter OrmoClear® OrmoClear®30 OrmoClear®FX
Viscosity 2.9 ± 0.3 Pa•s 30 ± 3 Pa•s 1.5 ± 0.3 Pa•s
Resolution Down to 100 nm feature sizes
Volume shrinkage 3 - 5 % << 2 % 3 - 5 %
Thermal stability Up to 270 °C (short term)
Refractive index
(589 nm, cured)		 1.555 1.561 1.555
Replication with PDMS molds
(no oxygen sensitivity)		 No No Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solutions
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OrmoClear®FX
Hybrid Polymers
micro resist technology
Contact Person
Dr. Jan Klein
Mail: j.klein@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
For UV imprint and UV moulding
OrmoClear®FX offers glass-like material properties after UV curing. It is optimized for micro- and nanooptical components of different pattern sizes and dimensions.
Unique Features
  • Highly transparent for near UV and VIS down to 350 nm
  • High thermal and mechanical stability
Applications
  • Moulded gratings and prisms
  • Micro lenses and micro lens arrays
  • Optical couplers and connectors
  • Microfluidic systems
  • Single elements or wafer scale
Parameter OrmoClear®FX OrmoComp®
Viscosity 1.5 +/- 0.3 Pa•s 2 ± 0.5 Pa•s
Resolution Down to 100 nm feature sizes
Thermal stability Up to 270 °C (short term)
Volume shrinkage 3 – 5 % 5 – 7 %
Refractive index (589 nm, cured) 1.555 1.520
Replication with PDMS molds
(no oxygen sensitivity)		 Yes Yes
Shelf-life 6 months
Solvent-free Yes, ready-to-use solutions
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mr-NIL200 series
Nanoimprint Resists
micro resist technology
Contact Person
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable NIL resist
mr-NIL200 is a photo-curable NIL resist specifically for applying hard and non-permeable stamp materials. The typical application field of mr-NIL200 is the use as an etch mask in pattern transfer processes for e.g. photonic applications. mr-NIL200 works without the need for any additional adhesion promoter or primer.
Unique Features
  • No need for additional adhesion promoter or primer proved on different substrates (Si, SiO2, Al, sapphire, Cu, different underlayer materials like LOR, UL1, UL3)
  • Can be cured under ambient conditions in the presence of air
  • Low viscosity renders fast cavitity filling and minimize propensity for air bubble defects
Application Examples

Step-and-repeat nanoimprint on pre-spin coated film for the fabrication of integrated optical devices
G Calafiore et al., J. Micro/Nanolith. MEMS MOEMS 14(3), 033506 Link to Abstract

Efficient fabrication of photonic and optical patterns by imprinting the tailored photo-curable NIL resist «mr-NIL200»
M Messerschmidt et al., Poster, International Conference on Micro & Nano Engineering MNE2018, Copenhagen Link to Poster

 Recommended process parameters

Process step Process parameter
Spin coating 3000 rpm for 30 s
Prebake 60 °C for 180 s
Imprint temperature Room temperature
Imprint pressure > 100 mbar
Exposure dose > 1J cm-2
Radiation source Option 1: broad band
Option 2: LED (365-405 nm)
Thinner mr-T 1078
Primer Not needed
(mr-APS1 for mr-NIL200 film thickness > 300nm)

 Film thickness and package size

Specifications Film thickness and package sizes
Ready to use solutions for standard film thickness (3000 rpm) mr-NIL200-100 nm
mr-NIL200-200 nm
mr-NIL200-300 nm
Customized film thickness upon request between (3000 rpm) 1 µm
Availalbe resist quantities 250 ml
500 ml
Larger volumes on request
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mr-XNIL26SF
Nanoimprint Resists
micro resist technology
Contact Person
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable NIL resist, solvent-free
Photo-curable NIL resist featuring high content of fluorinated components
Unique Features
  • high content of fluorinated components for easy stamp release and low defectivity
  • 100% organic, easy strippable with oxygen plasma
  • Can be diluted to 100nm film thickness using PGMEA or ma-T 1050
Applications
  • NIL applications where comparably low release forces are essential (e.g. imprints on top of a multilayer stack)
mr-XNIL26 version Film thickness
mr-XNIL26SF 4.8 µm
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mr-NIL210 series
Nanoimprint Resists
micro resist technology
Contact Person
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable NIL-Resist
mr-NIL210 is a purely organic, photo-curable NIL resist with oustanding dry etch characteristics. It features an excellent curing and nanoimprint performance and is particularly suitable for soft-NIL using soft stamp materials, e.g. PDMS.
Unique Features
  • Excellent curing properties, even under air (presence of oxygen)
  • Compatibility to PDMS working stamps for soft-NIL, preferably applied in combination with UV-PDMS KER-4690 
  • Outstanding dry etch stability against various substrates like silicon, quartz, or aluminum
  • Purely organic resist, residue-free removable with oxygen plasma possible after curing
Applications
  • Etch mask for pattern transfer processes (dry and wet etching)
  • Fabrication of nanostructures for
    • LEDs, photonic crystals
    • Patterned sapphire substrates (PSS)
    • Microelectronics
    • Organic electronics (OLED, OPV, OTFT)
    • Data storage (bit patterned media)
    • Lift-off applications in combination with  e.g. LOR (MCC, USA)

Recommended process parameters

Process step Process parameter
Spin coating 3000 rpm for 30 s
Prebake 60 °C for 180 s
Imprint temperature Room temperature
Imprint pressure > 100 mbar
Radiation intensity mr-NIL210-100nm: 100 mW cm-2
mr-NIL210-200nm: 50 mW cm-2
mr-NIL210-500nm: 50 mW cm-2
Radiation source Option 1: broad band
Option 2: LED (365-405 nm)
Thinner ma-T 1078
Primer mr-APS1

 

 Our available standard film thicknesses

mr-NIL210 version Film thickness @3000 rpm*
mr-NIL210-100nm 100 nm
mr-NIL210-200nm 200 nm
mr-NIL210-500nm 500 nm

* Customized film thickness available on request up to 2 µm

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mr-NIL 6000E series
Nanoimprint Resists
micro resist technology
Contact Person
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Photo-curable thermoplastic NIL resist
mr-NIL 6000E is a photo-curable thermoplastic NIL resist featuring excellent pattern stability after imprinting and radiation in subsequent processes with a thermal load
Unique Features
  • Excellent thermal structure stability in subsequent processes due to the photochemically induced crosslinking reaction during imprinting
  • 100% organic NIL resist → dry etching and stripping possible with pure oxygen plasma
Applications
  • Fabrication of nanopatterns by pattern transfer for e.g.
  • High brightness LEDs
  • Photonic crystals
  • Patterned media
  • Nano-optical devices, subwavelength optical elements
mr-NIL 6000E version Film thickness *
mr-NIL 6000.1E 100 nm
mr-NIL 6000.2E 200 nm
mr-NIL 6000.3E 300 nm
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mr-I 9000M series
Nanoimprint Resists
micro resist technology
Contact Person
Dr. Manuel Thesen
E-Mail: m.thesen@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 23weqwf
Element 25weqwf
Thermoset
Thermally curable NIL resist (Thermoset - no Tg after imprinting)
Unique Features
  • Excellent thermal structure stability (up to 250 °C in a two-step imprinting process) in subsequent processes due to the thermally induced crosslinking reaction during imprinting
  • 100% organic resist → dry etching and stripping possible with pure oxygen plasma
Applications

Fabrication of nanopatterns by pattern transfer for e.g.

  • High brightness LEDs
  • Photonic crystals
  • Patterned media
  • Nano-optical devices, subwavelength optical elements
mr-I 9000M version * Film thickness *
mr-I 9010M 100 nm
mr-I 9020M 200 nm
mr-I 9030M 300 nm
mr-I 9050M 500 nm
mr-I 9100M 1.0 µm

* Customized film thickness available on request

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Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices

Contact Person

Dr. Anja Voigt

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Element 23weqwf

Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays

Contact Person

Dr. Christine Schuster

E-Mail: c.schuster@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Element 23weqwf

Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

Contact Person