Element 2
+49 30 641 670 100
Element 1
info@microresist.de
ma-N 1400 series
Negative Photoresists
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Negative resist series for UV lithography
Single layer lift-off application, conventional pattern transfer processes
Unique Features
  • Tunable pattern profile: vertical to undercut
  • Good thermal stability of the resist pattern
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

 

ma-N 400: Thermal stability up to 110°C for metal evaporation

  • Mask for lift-off processes
  • Etch mask for semiconductors and metals
  • Mask for ion implantation

ma-N 1400

Resist Film thickness @ 3000 rpm
ma-N 1405 0.5 µm
ma-N 1407 0.7 µm
ma-N 1410 1.0 µm
ma-N 1420 2.0 µm
ma-N 1440 4.0 µm

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ma-N 400 series
Negative Photoresists
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Negative resist series for UV lithography
Single layer lift-off application, conventional pattern transfer processes
Unique Features
  • Tunable pattern profile: vertical to undercut
  • Good thermal stability of the resist pattern
  • High wet and dry etch resistance
  • Aqueous alkaline development
  • Easy to remove

 

ma-N 400: Thermal stability up to 110°C for metal evaporation

Application
  • Mask for lift-off processes
  • Etch mask for semiconductors and metals
  • Mask for ion implantation

ma-N 400

Resist Film thickness @ 3000 rpm
ma-N 405 0.5 µm
ma-N 415 1.5 µm
ma-N 420 2.0 µm
ma-N 440 4.1 µm
ma-N 490 7.5 µm

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ma-N 2400 series
Negative Photoresists
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Negative resist series for e-beam lithography
Conventional pattern transfer processes
Unique Features ma-N 2400 series for e-beam and deep UV lithography
  • High resolution capability (~ 40 - 50 nm)
  • Aqueous alkaline development
  • Good thermal stability of the resist patterns
  • High wet and dry etch resistance
  • Easy to remove
Applications
  • Mask for etching

ma-N 2400

Resist Film thickness @ 3000 rpm
ma-N 2401 0.1 µm
ma-N 2403 0.3 µm
ma-N 2405 0.5 µm
ma-N 2410 1.0 µm

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mr-DWL series
Negative Photoresists
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Negative resists for direct laser writing @ 405 nm
Permanent application and conventional pattern transfer processes
Unique Features
  • Sensitive above 400 nm, for direct writing laser @ 405 nm
  • High thermal and chemical stability
  • High wet and dry etch stability
Applications
  • Fast and contactless prototyping by
  • Permanent: Master/ template manufacture, mould for PDMS
  • Pattern transfer: Etch mask, mould for electroplating
Parameter
Resist Film tickness
mr-DWL 5 5.0 µm @ 3000 rpm
mr-DWL 40 40 µm @ 2000 rpm
mr-DWL 100 100 µm @ 1500 rpm

 

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EpoCore & EpoClad series
Negative Photoresists
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Negative resist series for UV lithography
Low optical loss permanent application
Unique Features
  • Standard UV lithography and PCB technology
  • High transmittance @ 850 nm
  • Optical loss ~ 0.2 dB/cm @ 850 nm
  • High heat and pressure resistance
  • Tunable refractive index (core/ cladding)
Applications
  • Optical polymer multimode (MM) and single mode (SM) waveguides:
  •  EpoCore as core and EpoClad as cladding material

EpoCore

Product Film thickness
EpoCore 2 2.0 µm @ 3000 rpm
EpoCore 5 5.0 µm @ 3000 rpm
EpoCore 10 10 µm @ 3000 rpm
EpoCore 20 20 µm @ 3000 rpm
EpoCore 50 50 µm @ 1500 rpm

EpoClad

Product Film thickness
EpoClad 2 2.0 µm @ 3000 rpm
EpoClad 5 5.0 µm @ 3000rpm
EpoClad 10 10 µm @ 3000rpm
EpoClad 20 20 µm @ 3000rpm
EpoClad 50 50 µm @ 1700 rpm

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mr-EBL 6000 series
Negative Photoresists
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Negative resist series for e-beam lithography
Conventional pattern transfer processes
Unique Features mr-EBL 6000 series for e-beam lithography
  • Excellent thermal stability of the resist patterns
  • High wet and dry etch resistance
  • High resolution capability (~ 40 - 50 nm)
  • Post exposure bake (PEB) required
  • Mask for etching

mr-EBL 6000

Resist Film thickness @ 3000 rpm
mr-EBL 6000.1 0.1 µm
mr-EBL 6000.3 0.3 µm
mr-EBL 6000.5 0.5 µm

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InkEpo series
Negative Photoresists
Inkjet Materials
micro resist technology

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
for Drop-on Demand Ink-jet printing
Ink Epo is an UV curable material for ink-jet-printing
Unique Features
  • UV curable ink solutions
  • Compatible with standard inkjet-printing devices
  • Excellent thermal, mechanical and chemical stability of cured patterns
Applications
  • Single micro-lenses and micro-lens arrays
  • Spacers and protecting layers
  • Glue for bonding applications
Parameter InkEpo
Viscosity 5, 8, 12 and 25 mPas
Solvent-free no

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MICROPOSIT™ LOL™2000 Lift Off Layer
DuPont

Contact Person

Franziska Kopp
E-Mail: f.kopp@microresist.de
Phone: +49 30 64 16 70 100
Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
For Bi-Layer Lift-Off Processes

Microposit LOL 2000 lift-off layer is an enhanced dissolution rate, dyed PMGI (polyme- thylglutarimide) solution used for lift-off processes requiring tight CD control, such as GMR thinfilm head, GaAs, and other leading-edge semiconductor applications. The LOL bilayer lift-off process is suitable for applications where a thin layer of metal is sputtered or evaporated in an addi- tive process. CD variation due to etch bias inherent in substractive processes is eliminated, resulting in superiormetallinewidthcontrol.Attackonthe substrates by an etchant is eliminated.

MICROPOSIT FSC – PROTECTIVE SURFACE COATING

MICROPOSIT FSC series surface coating is a non-imagable coating formulated as a protective coat for use during chemical or mechanical pro- cesses in microelectronic fabrication. The system has been formulated with a single solvent. It does not contain xylene, acetone, or Cellosolve acetate.

Microposit FSC Series Surface Coating is available in two thickness ranges.
  • FSC-M: 2.4 to 3.3 μm
    For front-side protection during backlapping 0.2 μm filtration

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SU-8 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Thick Negative Epoxy Photoresists
Permanent Applications
MATERIAL ATTRIBUTES
  • i-line imaging
  • High aspect ratio with vertical sidewalls
  • Photo-definable ultra-thick structures
  • Outstanding chemical and thermal stability
  • Excellent dry-etch resistance
  • Film thickness from 2 -> 200 µm with single spin coat processes
APPLICATIONS
  • MEMS
  • PDMS molding
  • Microfluidics
  • Inkjet nozzles

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SU-8 2000 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Thick Negative Epoxy Photoresists
Permanent Applications
MATERIAL ATTRIBUTES
  • i-line imaging
  • High aspect ratio with vertical sidewalls
  • 0.5 -> 200 µm film thickness in a single coat
  • Improved coating properties
  • Faster drying for increasing throughput
  • Outstanding chemical and thermal stability
APPLICATIONS
  • MEMS
  • PDMS molding
  • Displays
  • Rapid prototyping

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SU-8 3000 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Thick Negative Epoxy Photoresists
Permanent Applications
MATERIAL ATTRIBUTES
  • i-line imaging
  • High aspect ratio with vertical sidewalls
  • Up to 100 µm film thickness in a single coat
  • Improved adhesion
  • Reduced coating stress
  • Outstanding chemical and thermal stability
APPLICATIONS
  • MEMS
  • PDMS molding
  • Waveguides
  • Microfluidics

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SU-8 TF 6000 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
High Resolution Thin Negative Epoxy Photoresist
Permanent Applications
MATERIAL ATTRIBUTES
  • Photo-imageable thin films with high resolution i-line patterning capability
  • Broadband, i-line, g-line and h-line sensitivity
  • 0.5 to > 10µm film thickness
  • High uniform coatings
  • Low temperature cure (< 150°C)
  • Outstanding chemical and thermal stability
APPLICATIONS
  • High resolution imaging of thin permanent structures
  • MEMS
  • Display pixel walls and dielectric layers

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KMPR® 1000 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Permanent and Temporary Applications
MATERIAL ATTRIBUTES
  • High aspect ratio with vertical sidewalls
  • > 100 µm film thickness in a single coat
  • Good adhesion to most substrates
  • Alkaline developer compatible (TMAH and KOH)
  • Strippable with wet or dry chemistry
  • Excellent dry etch resistance
APPLICATIONS
  • MEMS
  • DRIE mask
  • Electroplating

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PermiNex® 1000 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications
MATERIAL ATTRIBUTES
  • Negative tone, photoimageable resists
  • Solvent development with PN 1000 Developer
  • i-line imaging, up to 3:1 aspect ratio
  • Low temperature processing (<200°C)
  • High quality, void free bonding
  • Excellent adhesion to silicon and glass
APPLICATIONS
  • Definition an capping of cavity structures
  • BAW and SAW devices
  • MEMS, MOEMS, microfluidics devices

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PermiNex® 2000 series
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Photoimageable Wafer Bonding Adhesives for Permanent and Non-hermetic Applications
MATERIAL ATTRIBUTES
  • Negative tone, photoimageable resists
  • Alkaline development with standard TMAH Developer
  • i-line imaging, up to 3:1 aspect ratio
  • Low temperature processing (<200°C)
  • High quality, void free bonding
  • Excellent adhesion to silicon and glass
APPLICATIONS
  • Definition an capping of cavity structures
  • BAW and SAW devices
  • MEMS, MOEMS, microfluidics devices

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KMSF® 1000
Dielectric Materials
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Low Stress Dielectric Photoresist
MATERIAL ATTRIBUTES
  • Negative tone, photoimageable dielectric
  • No warpage due to low shrinkage and tensile modulus
  • Solvent developable
  • i-line/broadband sensitivity, 1:1 aspect ratio imaging
  • Low temperature processing (<200°C)
  • Good electrical properties
  • High thermal and chemical stability
  • Low moisture uptake
APPLICATIONS
  • Stress buffer
  • Passivation and protective layer

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SU-8 Microspray
Negative Photoresists
Kayaku Advanced Materials

Contact Person

Dr. Anja Voigt
E-Mail: a.voigt@microresist.de
Phone: +49 30 64 16 70 100
Anja Hinz
E-Mail: a.hinz@microresist.de
Phone: +49 30 64 16 70 100
Element 25weqwf
Photoresist Aerosol Can

These aerosol spray-can photoresists are well suited for a variety of micromachining, and etching processes, requiring semi- conformal coatings on irregular or perforated substrates. It addresses many of the process and capital requirements for MEMs, microfluidics, opto-electronics and “one-up” printed circuit boards.

APPLICATIONS & USES
  • Uniform coatings without spin-coater tool
  • Striation free coatings over deep topography
  • Perforated or irregular substrates
  • Large substrates
  • Microfluidic electrophoresis analysis
  • Lab-on-Chip
  • Patterned through-wafer vias
  • “One up” PCBs
  • Spray coater tool pre-evaluation
  • Backside coatings
  • Touch-up coatings

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If necessary, please also use the general contact on our website – we will get back to you as soon as possible!

Element 32
0

Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices

Contact Person

Dr. Anja Voigt

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays

Contact Person

Dr. Christine Schuster

E-Mail: c.schuster@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

Contact Person

Dr. Jan Klein

E-Mail: j.klein@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

Contact Person

Dr. Manuel Thesen

E-Mail: m.thesen@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100

Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy

Contact Person

Dr. Anja Voigt

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Dr. Jan Klein

E-Mail: j.klein@microresist.de

Phone: +49 30 64 16 70 100

Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics

Contact Person

Carsten Schröder

E-Mail: c.schroeder@microresist.de

Phone: +49 30 64 16 70 100

Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.

Contact Person

Franziska Kopp

DuPont Electronics & Imaging Products

E-Mail: f.kopp@microresist.de

Phone: +49 30 64 16 70 100

Dr. Anja Voigt

Kayaku Advanced Materials, DJ Mikrolaminates

E-Mail: a.voigt@microresist.de

Phone: +49 30 64 16 70 100

Anja Hinz

Kayaku Advanced Materials, DJ Mikrolaminates

E-Mail: a.hinz@microresist.de

Phone: +49 30 64 16 70 100