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InkEpo series
Negative Photoresists
Inkjet Materials
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InkEpo series - UV curable material for inkjet-printing
Unique Features
  • UV-curable, solvent based inks
  • Low viscosities
  • Compatible to standard inkjet-printing devices
  • Excellent thermal, mechanical and chemical stability of cured patterns
  • High transparency to near UV and visible light
Applications
  • Single micro-lenses and micro-lens arrays
  • Waveguides and microfluidic devices
  • Spacers and protecting layers
  • Glue for bonding applications
  • Large-area substrate processing
Material Viscosity

[mPas]

 Viscosity Viscosity Temperature stability after curing Suggested applications
InkEpo series 5 ± 0.3

8 ± 0.5

12 ± 1

25 ± 1

 Yes 1.555 Up to 180 °C Permanent optical applications (e.g. microlenses, waveguides)
Alternative Inkjet Materialien:
InkOrmo series 7 ± 1

12 ± 1.5

18 ± 2

 No 1.517 – 1.520 Up to 270 °C Permanent optical applications (e.g. microlenses)
mr-UVCur26SF 15 ± 2

(lösungsmittelfrei)

 Yes 1.518 Up to 180 °C Etch mask, Step & Repeat NIL processes, large-area structuring of flexible substrates

InkEpo Serie

Resist Viscosity [mPas]

@ r.t.

 Spectral Sensitivity Special Features
InkEpo 5 5 i-line - 365nm solvent containing ink, for permanent optical application
InkEpo 8 8
InkEpo 12 12
InkEpo 25 25

Recommended process chemicals:

Thinner: no thinner available
Developer: not required
Remover: mr-Rem 700 (NMP & NEP free), mr-Rem 500 (NMP free), O2-plasma

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InkOrmo series
Hybrid Polymers
Inkjet Materials
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For Drop-on-Demand Ink-Jet Printing
InkOrmo is a UV-curable ink-solution offering glass-like material properties after curing and it is ideally for the fabrication of micro-lenses via ink-jet printing
Unique Features
  • Excellent thermal, mechanical and chemical stability of cured patterns
  • High transparency to near UV and visible light
  • Compatible to standard ink-jet heads
Applications
  • Single micro-lenses and micro-lens arrays
  • Waveguides and microfluidic devices
  • Spacers and protecting layers
  • Large-area substrate processing
Material Viscosity

[mPas]

 Oxygen insensitive curing Refractive index (589 nm) after curing Temperature stability after curing Suggested applications
InkOrmo series 7 ± 1

12 ± 1.5

18 ± 2

 No 1.517 – 1.520 up to 270 °C Permanent optical applications (e.g. microlenses)
Alternative Inkjet materials:
InkEpo series 5 ± 0.3

8 ± 0.5

12 ± 1

25 ± 1

 No 1.555 up to 180 °C Permanent optical applications (e.g. microlenses, waveguides)
mr-UVCur26SF 15 ± 2

(solvent free)

 Yes 1.518 up to 180 °C Etch mask, Step & Repeat NIL processes, large-area structuring of flexible substrates
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mr-UVCur26SF
Nanoimprint Resists
Inkjet Materials
Dry etch mask, permanent nanostructures
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Photo-curable NIL-Resist
mr-UVCur26SF is a pure organic and solvent-free Photo-NIL resist developed for inkjet dispensing. The low viscosity and the fast photo-curing reaction makes mr-UVCur26SF suitable for continuous roll-to-roll NIL processes.
Unique Features
  • Inkjet dispensing at room temperature due to low viscosity (15 mPas), e.g. for step-and-repeat NIL processes
  • No prebake after substrate coating due to solvent-free resist formulation
  • Very fast curing for high throughput R2R-NIL, web speed up to 30 m/min shown
  • Good adhesion to PC and PET substrates
  • Excellent dry etch stability for pattern transfer processes
  • Residue-free removable with oxygen plasma
Applications
  • Etch mask for pattern transfer processes (dry and wet etching)
  • Application of  nanostructures on polymer foils
  • Fabrication of nanostructures for
    • Nano-optical devices, SOEs
    • Organic electronics (OLED, OPV, OTFT)
    • Microelectronics
    • LEDs, photonic crystals
Material Viscosity

[mPas]

 Oxygen insensitive curing Refractive index (589 nm) after curing Temperature stability after curing Suggested applications
mr-UVCur26SF 15 ± 2

(lösungsmittelfrei)

 Yes 1.518 up to 180 °C Etch mask, Step & Repeat NIL processes, large-area structuring of flexible substrates
Alternative Inkjet materials:
InkEpo Serie 5 ± 0.3

8 ± 0.5

12 ± 1

25 ± 1

 No 1.555 up to 180 °C Permanent optical applications (e.g. microlenses, waveguides)
InkOrmo Serie 7 ± 1

12 ± 1.5

18 ± 2

 No 1.517 – 1.520 up to 270 °C Permanent optical applications (e.g. microlenses)
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Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices
View all Negativ Photoresists
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Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays
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Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

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Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

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Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy
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Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics
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Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.