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SUEX™
Dry Film Photoresist
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Dry film Resists for MEMS, Microfluidics and Packaging applications
Features

SUEX™ and ADEX™ (DJ MICROLAMINATES Inc.) Dry Film Photoresists are high performance, i-line sensitive, photo-imageable epoxy films available as both sheets and rolls. These films are easily applied using low cost laminating equipment, eliminating the waste and inconvenience associated with spin coating. Film thicknesses from 5 μm to 500 μm and aspect ratios > 20:1 are possible with these convenient to use sheets. Sheets are pre-cut to variety of standard substrate and panel sizes and rolls are available in a variety of widths and lengths. A solvent-free manufacturing technique yields exceptional film thickness uniformity and extremely low average surface roughness.

* Other sheets sizes on request

Resist Film thickness
sheet/roll sizes*		 Developer
SUEX™ K 20 μm; 25 μm; 30 μm; 40 μm; 50 μm; 75 μm;
100 μm; 125 μm; 150 μm; 200 μm; 225 μm;
250 μm; 300 μm; 350 μm; 400 µm; 500 μm
Pre-cut sheets (wafer cut sizes, round/ square/
rectangular)		 mr-Dev 600
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ADEX™
Dry Film Photoresist
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Dry film Resists for MEMS, Microfluidics and Packaging applications
Features

ADEX™ and SUEX™ (DJ MICROLAMINATES Inc.) Dry Film Photoresists are high performance, i-line sensitive, photo-imageable epoxy films available as both sheets and rolls. These films are easily applied using low cost laminating equipment, eliminating the waste and inconvenience associated with spin coating. Film thicknesses from 5 μm to 500 μm and aspect ratios > 20:1 are possible with these convenient to use sheets. Sheets are pre-cut to variety of standard substrate and panel sizes and
rolls are available in a variety of widths and lengths. A solvent-free manufacturing technique yields exceptional film thickness uniformity and extremely low average surface roughness.

* Other sheets sizes on request

Resist Film thickness
sheet/roll sizes*		 Developer
ADEX™ A 5 μm; 10 μm; 20 μm; 50 μm Pre-cut sheets
(wafer cut sizes, round/ square/ rectangular)
and rolls		 mr-Dev CH
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MX5000 series
Dry Film Photoresist
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High Performance & High Resolution Multi-Purpose Polymer Film for Wafer Bumping, and Copper Pillar Applications
Features
  • Multipurpose, e.g. - Via (TSV) formation (DRIE), plating and protection, RDL etching
  • Filmthickness - 15-50 µm
  • Removable
  • Developer - Spray development, 0.75% K2CO3 (mr-D 4000/ 75)
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WBR2000 series
Dry Film Photoresist
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High Performance & High Resolution Multi-Purpose Polymer Film for Wafer Bumping, and Copper Pillar Applications
MPF Product Features/ Application
  • Negative working, aqueous processable polymer film
  • Three layer package
  • Suitable for in-via and mushroom electroplating bumping applications.
  • Suitable for photo stenciling applications.
  • Strong heat resistance.
  • High resolution capability.
  • Wide processing latitude.
  • WBRTM series is compatible with the following typical surfaces:
    • Silicon
    • Silicon Nitride
    • Sputtered copper
    • Sputtered gold
    • PI/BCB with UBM
  • Polymer film thickness: 50, 75, 100 and 120 microns
  • Unexposed Color in Yellow Light: Light Green
  • Exposed Color in Yellow light: Dark Blue
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Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices
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Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays
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Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

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Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

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Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy
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Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics
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Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.