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SUEX™
Dry Film Photoresist
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Dry film Resists for MEMS, Microfluidics and Packaging applications
Features

SUEX™ and ADEX™ (DJ MICROLAMINATES Inc.) Dry Film Photoresists are high performance, i-line sensitive, photo-imageable epoxy films available as both sheets and rolls. These films are easily applied using low cost laminating equipment, eliminating the waste and inconvenience associated with spin coating. Film thicknesses from 5 μm to 500 μm and aspect ratios > 20:1 are possible with these convenient to use sheets. Sheets are pre-cut to variety of standard substrate and panel sizes and rolls are available in a variety of widths and lengths. A solvent-free manufacturing technique yields exceptional film thickness uniformity and extremely low average surface roughness.

* Other sheets sizes on request

Resist Film thickness
sheet/roll sizes*
Developer
SUEX™ K 20 μm; 25 μm; 30 μm; 40 μm; 50 μm; 75 μm;
100 μm; 125 μm; 150 μm; 200 μm; 225 μm;
250 μm; 300 μm; 350 μm; 500 μm
Pre-cut sheets (wafer cut sizes, round/ square/
rectangular)
mr-Dev 600

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ADEX™
Dry Film Photoresist
Element 25weqwf
Dry film Resists for MEMS, Microfluidics and Packaging applications
Features

ADEX™ and SUEX™ (DJ MICROLAMINATES Inc.) Dry Film Photoresists are high performance, i-line sensitive, photo-imageable epoxy films available as both sheets and rolls. These films are easily applied using low cost laminating equipment, eliminating the waste and inconvenience associated with spin coating. Film thicknesses from 5 μm to 500 μm and aspect ratios > 20:1 are possible with these convenient to use sheets. Sheets are pre-cut to variety of standard substrate and panel sizes and
rolls are available in a variety of widths and lengths. A solvent-free manufacturing technique yields exceptional film thickness uniformity and extremely low average surface roughness.

* Other sheets sizes on request

Resist Film thickness
sheet/roll sizes*
Developer
ADEX™ A 5 μm; 10 μm; 15 μm; 20 μm Pre-cut sheets
(wafer cut sizes, round/ square/ rectangular)
and rolls
mr-Dev 600,
mr-Dev CH
(for high resolution features)

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MICROPOSIT™ S1800™ G2 series
Positive Photoresists
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For Microlithography Applications

MICROPOSIT S1800 G2 series photoresist are positive photoresist systems engineered to satisfy the microelectronics industry’s requirements for IC device fabrication. The system has been engineered using a toxico- logically – safer alternative casting solvent to the ethylene glycol derived ether acetates.

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MICROPOSIT™ SPR™ 3000 series
Positive Photoresists
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For Microlithography Applications

MEGAPOSIT SPR3012/ 3510/3600

Series Photoresist are positive photoresist engineered for i-line, g-line and broadbandapplication while providing high- through- put and excellent lithographic performance.

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MICROPOSIT™ SPR™ 220 series
Positive Photoresists
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For Microlithography Applications

MEGAPOSITSPR220i-linephoto- resist is an optimized general-pur- pose, multi-wavelength resist designed to cover a wide range of film thicknesses, 1-30 μm, with a single-coat process. MEGAPOSITSPR220photoresistalsohas excellent adhesion and plating characteri- stics, which make it ideal for such thick film applications as MEMS and bump process.

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MICROPOSIT™ SPR™ 660 series
Positive Photoresists
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For Microlithography Applications

SPR660 series is an advanced i-line photo- resist designed for processing 0.350 micron features and larger. SPR660 performs in both line / space and contact hole applica- tion and on variety of substrates, including silicon dioxide, titanium nitride, and organic anti-reflectant coatings. The SPR660 product family includes a range of undyed dilutions as well dye loadings for improved processing over reflective surface.

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MICROPOSIT™ SPR™ 700 series
Positive Photoresists
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For Microlithography Applications

MEGAPOSITSPR700seriesphotoresists are positive multiwavelength photoresists that are optimized to provide robust process latitudes and high throughput with excellent thermal stability. SPR700 resists are com- patible across a wide variety of developer families. This versatility makes SPR700 pho- toresists ideal for a number of applications, especially mix and match lithography.

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MICROPOSIT™ SPR™ 955 series
Positive Photoresists
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For Microlithography Applications

MEGAPOSITSPR955-CMseriesphoto- resist is a general purpose, high – through- put, i-line photoresist for 0.35 μmfront-end and back-end applications.SPR955-CM is optimized for anti-reflective (organic and inorganic) coating.

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ULTRA-i™-123-0.8
Positive Photoresists
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ULTRA-i™-123 is an advanced, general-purpose, 250 nm critical i-line photoresist with extendibility to 230 nm and below.

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UV5™ series
Positive Photoresists
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For Microlithography Applications

UV5 positive DUV photo resist has been optimized to provide vertical profile imaging of isolated and semidense features for device production design rules to 150nm.

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UV6™ series
Positive Photoresists
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For Microlithography Applications

UV60 is a positive DUV photoresist designed for consolidation of implant, metal contact hole and via applications for 200 nm features. UV60 works well on reflective substrates.

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UV™26G series
Positive Photoresists
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Description

UV26 is a positive DUV photoresist developed for deep Implant applications. The low viscosity of UV26 allows for redu- ced dispense volume and improved coating. Uniformity for film ranging from 0.7 μm to 3.0 μm. UV26G is the long term “green” replacement of UV26

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UV™210GS series
Positive Photoresists
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For Microlithography Applications

UV210GS is a multipurpose resist that can be utilized for gate, phase shift mask contact holes and trench applications in 180 – 130 nm CD range.

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MICROPOSIT™ LOL™2000 Lift Off Layer
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For Bi-Layer Lift-Off Processes

Microposit LOL 2000 lift-off layer is an enhanced dissolution rate, dyed PMGI (polyme- thylglutarimide) solution used for lift-off processes requiring tight CD control, such as GMR thinfilm head, GaAs, and other leading-edge semiconductor applications. The LOL bilayer lift-off process is suitable for applications where a thin layer of metal is sputtered or evaporated in an addi- tive process. CD variation due to etch bias inherent in substractive processes is eliminated, resulting in superiormetallinewidthcontrol.Attackonthe substrates by an etchant is eliminated.

Microposit FSC Series Surface Coating is available in two thickness ranges.
  • FSC-M: 2.4 to 3.3 μm
    For front-side protection during backlapping 0.2 μm filtration

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CYCLOTENE™ 3000 series
Dielectric Materials
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Cyclotene 3000 series

The CYCLOTENE 3000 series Advanced Electronic Resins derived from B-staged bisbenzocyclobutene (BCB) monomers are dry-etch grades of the CYCLOTENE family of products, and were developed for use as spin-on dielectric materials in microelectronic device fabrication. The CYCLOTENE Resins are low dielectric constant and low dielectric loss materials, and feature low moisture absorption, no out-gassing, low temperature cure and excellent planarization.

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CYCLOTENE™ 4000 series
Dielectric Materials
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Cyclotene 4000 series

The CYCLOTENE 4000 Series advanced electronic resins are I-line-, G-line-, and broad band-sensitive photopolymers that have been developed for use as dielectrics in thin film microelectronics applications. These polymers are derived from B-staged bisbenzocyclobutene (BCB) chemistry and have final film properties that are similar to the dry etchable 3000 series.

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CYCLOTENE™ 6505
Dielectric Materials
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Cyclotene 6505

The CYCLOTENETM 6505 advanced electronic resins are I-line-, G-line-, and broadband-sensitive photopolymers that have been developed for use as dielectrics in thin film microelectronics applications. The polymers are based on B-staged aqueous developable bis-benzocyclobutene (ADBCB) chemistry, and have final film properties that are similar to legacy CYCLOTENETM 4000 and CYCLOTENETM 3000 series. CYCLOTENETM 6505 is TMAH developable, enabling high resolution and multilayer stack build dielectric material.

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MX5000 series
Dry Film Photoresist
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Features
  • Multipurpose, e.g. - Via (TSV) formation (DRIE), plating and protection, RDL etching
  • Filmthickness - 15-50 µm
  • Removable
  • Developer - Spray development, 0.75% K2CO3 (mr-D 4000/ 75)

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WBR2000 series
Dry Film Photoresist
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High Performance & High Resolution Multi-Purpose Polymer Film for Wafer Bumping, and Copper Pillar Applications
MPF Product Features/ Application
  • Negative working, aqueous processable polymer film
  • Three layer package
  • Suitable for in-via and mushroom electroplating bumping applications.
  • Suitable for photo stenciling applications.
  • Strong heat resistance.
  • High resolution capability.
  • Wide processing latitude.
  • WBRTM series is compatible with the following typical surfaces:
    • Silicon
    • Silicon Nitride
    • Sputtered copper
    • Sputtered gold
    • PI/BCB with UBM
  • Polymer film thickness: 50, 75, 100 and 120 microns
  • Unexposed Color in Yellow Light: Light Green
  • Exposed Color in Yellow light: Dark Blue

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WPR1000 series
Dry Film Photoresist
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Features
  • Multipurpose Resist (green-yellow colour) for permanent applications
  • Filmthickness - 50, 75, 100 µm
  • Permanent
  • Developer - Spray development, 0.85% Na2CO3 anhydrous or 1% Na2CO3monohydrate

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If necessary, please also use the general contact on our website – we will get back to you as soon as possible!

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Negative Photoresists

Photoresists for UV (mask aligner, laser)/ DUV and e-beam lithography

  • Effective for broadband and i-line, Deep UV, e-beam exposure, or laser direct writing @ 405 nm
  • Lift-off resists with tunable pattern profile, high temperature stability up to 160 °C
  • Variety of viscosities for different film thicknesses in one spin-coating step
     
  • For pattern transfer: Physical vapour deposition (PVD) and single  layer lift-off, etch mask, mould for electroplating
  • For permanent applications: Polymeric waveguides
  • Use in microsystems technology, microelectronics, micro-optics  – manufacture of e.g. LEDs, ICs, MEMS, flat panel displays, fiber optics telecommunications devices

Positive Photoresists

Positive Photoresists for UV lithography (mask aligner, laser, greyscale exposure) and e-beam lithography

  • Variety of viscosities for 0.1 µm – 60 µm film thickness in one spin-coating step
  • Effective for broadband, g-line, h-line or i-line exposure, laser direct writing at 350…450 nm and e-beam lithography
  • No post exposure bake
  • Easy removal
     
  • For pattern transfer: Etch mask, mould for electroplating, mould for UV moulding
  • Use in microsystems technology, microelectronics, micro-optics – manufacture of e.g. MEMS, LEDs, ICs, MOEMS, fiber optics telecommunications devices, flat panel displays

Hybrid Polymers

micro resist technology offers a broad portfolio of UV-curable hybrid polymer products for micro-optical applications. Their excellent optical transparency and high thermal stability makes them perfectly suitable for the production of polymer-based optical components and waveguides. The main fields of application are micro lenses, diffractive optical elements (DOE), gratings, and single-mode or multi-mode waveguides.

OrmoComp®: DE 30 210 075 433; IR 1 091 982 ; TW 100030626; OrmoClear®: DE 30 210 075 434; IR 1 091 359 ; TW 100030628; OrmoStamp®: DE 30 210 075 435; IR 1 092 621 ; TW 100030629; OrmoPrime®: DE 30 210 075 436

Nanoimprint Resists

Nanoimprint Lithography (NIL) is a straight forward, low cost, and high throughput capable technology for the fabrication of nanometer scaled patterns. Main application fields are photonics, next generation electronics, as well as bio- and sensor applications.

micro resist technology GmbH has provided tailor-made resist formulations for nanoimprint lithography (NIL) since 1999. The unique key features of our products are outstanding film forming and imprinting performance beside excellent pattern fidelity and plasma etch stability. Besides our highly innovative material developments in close contact to industrial needs, our strength is the ability to adjust our materials in film thickness as well as addressing certain needs of the specific use cases within the formulation. Our nanoimprint resists are mostly applied as an etch mask for pattern transfer into various substrates, like Si, SiO2, Al or sapphire.

Our portfolio covers materials for the classical thermal NIL (T-NIL), in which a thermoplastic polymer is used, as well as UV-NIL, in which a liquid formulation is photo crosslinked upon photo exposure. With our technological expertise and know-how we are able to find the right material for your process and applications. Please contact us for your technical support!

Functional materials for inkjet-printing

Special designed functional materials from the product groups Hybrid Polymers, Photoresists, and Nanoimprint Polymers for the deposition and alternative patterning using inkjet printing process

  • Available in different viscosities (adjustable)
  • Suitable in commercial inkjet printing devices
  • Focused on high reliability of droplet generation
  • UV-curable formulations

 

  • Usable as a permanent material for optical application (e.g. lenses, wave guides, optical couplers, diffractive elements, …)
  • Packaging material in the micro electronic
  • Deposition / patterning on substrates with surface topography
  • Imprint material for nano-structuring with high dose accuracy

Dry Films

Dry films are ready-to-use polymer films as laminate foil with a high accuracy of the film thickness and excellent adhesion behaviour on various substrates. They are very simple in handling, photo-structurable and both as cut sheets and as roll material available.

  • Available in different film thicknesses
  • UV-crosslinking as negative photoresist
  • Feasibility of high aspect ratios
  • Vertical sidewalls
  • Multi lamination possible – up to 6 layer  complex multi-layer designs
  • High chemical resilience

 

  • Application as permanent material for optical application (e.g. lenses, wave guides …), in micro fluidics

Resist Alliance

micro resist technology is a single entry point for specialty chemicals used in micro and nano manufacturing in Europe. The portfolio of in-house products is complemented by the strategic sales of associated products that are manufactured by our international partners. Here we act as a high-service distributor and offer European medium-sized companies a wide range of complementary products from a single source, which can be used for both established and innovative production and manufacturing processes.

DuPont Electronic Solutions (formerly DOW Electronic Materials / Rohm and Haas Europe Trading ApS)

We offer products for semiconductor technologies, advanced packaging and dry film resists from our partner DuPont, with whom we have been working for more than 20 years.

Kayaku Advanced Materials, Inc. (formerly MicroChem Corp.)

We offer photoresists and specialty chemicals for MEMS and microelectronic applications from our partner Kayaku Advanced Materials, with whom we have been working for more than 20 years.

DJ MicroLaminates, Inc.

We offer dry film resists for MEMS, microfluidics and packaging applications from our partner DJ MicroLaminates, with whom we have been cooperating for over two years.