Negative Resists for  e-beam and Deep UV lithography

  • Effektive for  e-beam or Deep UV exposure
  • Variety of viscosities for different film thicknesses in one spin-coating step

For pattern transfer processes: Mould for electroplating, mater/ template manufacture, etch mask

Beispiel Produkt Application Thickness range PDF Details
ma-N 2400 & mr-EBL 6000 series

Etch mask

0.1 µm – 1.0 µm/ 0.1 µm – 0.6 µm