In this nanoimprint technology, a thin film is deposited onto a substrate by applying e.g. spin-coating . Then, a micro- or nanostructured stamp is pressed with low pressure into the liquid resist film at room temperature. After complete filling of the stamp cavities, the NIL resist is solidified by means of a photo-induced chemical curing reaction. Subsequently, the stamp can be removed from the solidified NIL resist obtaining a negative stamp pattern on the substrate. In most cases, the imprinted structures are finally transferred by subsequent plasma etching steps into the substrate.
The resists can be applied in different coating methods.
- Spin coating : mr-NIL210, mr-UVCur21, mr-XNIL26
- Alternative coating procedures, e.g. inkjet dispensing or gravure printing: mr-UVCr26SF