mr-UVCur26SF

Photo-Nanoimprint Lithography

mr-UVCur26SF is a pure organic and solvent-free Photo-NIL resist developed for inkjet dispensing. The low viscosity and the fast photo-curing reaction makes mr-UVCur26SF suitable for continuous roll-to-roll NIL processes.

Unique Features

  • Inkjet dispensing at room temperature due to low viscosity (15 mPas), e.g. for step-and-repeat NIL processes
  • No prebake after substrate coating due to solvent-free resist formulation
  • Very fast curing for high throughput R2R-NIL, web speed up to 30 m/min shown
  • Good adhesion to PC and PET substrates
  • Excellent dry etch stability for pattern transfer processes
  • Residue-free removable with oxygen plasma

Applications

  • Etch mask for pattern transfer processes (dry and wet etching)
  • Application of  nanostructures on polymer foils
  • Fabrication of nanostructures for
    • Nano-optical devices, SOEs
    • Organic electronics (OLED, OPV, OTFT)
    • Microelectronics
    • LEDs, photonic crystals

 Process parameters for inkjet dispensing

Process step

Process parameter

Inkjet parameter

Piezo actuated printhead, dispensing possible at room temperature

Prebake

Not necessary (solvent-free)

Imprint temperature

Room temperature

Imprint pressure

> 100 mbar

Radiation dose

> 500 mJ cm-2 (λ =  320 – 420 nm)

Thinner

Not recommended

Primer

mr-APS1 (e.g. for Si)

 Process parameters for roll-to-roll NIL

Process step

Process parameter

Resist application method

Gravure printing, inkjet dispensing, etc.

Prebake

Not necessary (solvent-free)

Web speed

Depending on and limited by tool setup and light source, up to 30 m/min shown so far

Imprint temperature

Room temperature

Imprint pressure

Depending on roller imprinter

Radiation dose

> 500 mJ cm-2 (λ =  320 – 420 nm)

Thinner

Not recommended

Primer

Not necessary (good adhesion to PC, PET, etc.)

mr-UVCur26SF is available in the following quantities:

  • 100 ml
  • 250 ml
  • 500 ml
  • 1000 ml
  • Larger packing sizes available on request

mr-XNIL26SF

Photo-Nanoimprint Lithography

Photo-curable NIL resist featuring high content of fluorinated components

Unique Features

  • high content of fluorinated components for easy stamp release and low defectivity
  • 100% organic, easy strippable with oxygen plasma
  • Can be diluted to 100nm film thickness using PGMEA or ma-T 1045

Applications

  • NIL applications where comparably low release forces are essential (e.g. imprints on top of a multilayer stack)
     

mr-XNIL26 version

Film thickness

mr-XNIL26SF

4.8 µm

Our NIL polymers are available in the following filling sizes:

  • 0.25 l
  • 0.5 l
  • 1.0 l
  • 100 ml as sample on request (extra charge for small quantities)

mr-UVCur21 series

Photo-Nanoimprint Lithography

mr-UVCur21 is a photo-curable NIL resist with excellent dry etching stability

Unique Features

  • Low-viscosity photo-NIL formulation, fast filling of stamp cavities
  • Fast curing at low UV dose and short imprint cycle times
  • Residue-free removal by oxygen plasma etching

Applications

Fabrication of nanostructures

  • Microelectronics
  • Data storage (BPM)
  • Nano-optical devices
  • Photonic crystals
  • Mask for pattern transfer processes (dry and wet etching)
  • Lift off applications in combination with e.g. LOR (from MCC, USA)
     

mr-UVCur21 version

Film thickness *

mr-UVCur21-100nm

100 nm

mr-UVCur21-200nm

200 nm

mr-UVCur21-300nm

300 nm

mr-UVCur21SF

1.7 µm

* Further film thicknesses available on request

Our NIL polymers are available in the following filling sizes:

  • 0.25 l
  • 0.5 l
  • 1.0 l
  • 2.5 l
  • 100 ml as sample on request (extra charge for small quantities)