• Contact
  • micro resist technology GmbH
  • Koepenicker Str. 325
  • 12555 Berlin
  • GERMANY
  • phone   +49 30 64 16 70 100
  • fax       +49 30 64 16 70 200
  • mail   sales@microresist.de
  • Contact Form
  • Your Message ›››
  • Order Form
  • Your Order ›››
  • Distributors
  • South Korea ›››
  • USA ›››
  • Italy ›››
  • Japan ›››
  • UK & Ireland ›››
  • Israel ›››
  • Taiwan ›››
  • Download Service
  • FAQs ›››
  • Catalogues/ Flyer ›››
  • Newsletter ›››
  •  

    Products»
    micro resist technology GmbH

     Polymers for Nanoimprint Lithography  »mr-UVCur06«

    Currently available products

    ...for thermal NIL

    » mr-I 7000E & mr-I 8000E

    » mr-NIL 6000

    » mr-I 9000E

    » mr-I PMMA

    » mr-I T85

    » mr-I 9000M

    ...for UV-based NIL

    » PDF › mr-UVCur21 and mr-UVCur06


    Details of product  » mr-UVCur21 and mr-UVCur06 «

    Unique features


  • Compatibility with various nanoimprint tools:
    – Wafer-scale or step&repeat UV-imprints
    – Imprinting in vacuum or under atmospheric pressure
  • Excellent film quality and thickness uniformity
  • Short cycle times due to fast filling of mould cavities
  • Pattern resolution below 30 nm (mr-UVCur21, limited by the mould, not by the polymer)
  • Very low residual layer thickness (< 10 nm)
  • Short curing times, low UV doses, compatibility with various UV lamps and filter systems
  • High plasma etch resistance, no residues after oxygen plasma etching (silicon-free polymer)
  • Appropriate adhesion promoter available
  • Applications


  • Etch mask for pattern transfer processes (dry and wet etching)
  • Fabrication of nanopatterns
    – Data storage
    – Nano-optical devices, sub-wavelength optical elements
    – Photonic crystals
    – Micro- and Nanofluidics
    – Microelectronics
  • Coating of various substrate materials, e.g.
    z.B. Si, SiO2, Al

  • Process flow



    Examples

    mr-UVCur06

    800 nm squares imprinted,
    1200 nm pitch,
    large-area imprint
    (Courtesy of Profactor, Austria)

    mr-UVCur06

    350 nm trenches,
    residual layer thickness below 10 nm
    (Courtesy of Profactor, Austria)

    mr-UVCur06



    Examples

    mr-UVCur21

    80 nm lines imprinted,
    pattern dept 110 nm
    (Courtesy of AMO)

    mr-UVCur21

    Excellent filling of mould patterns
    with demanding filling factors
    100x100 µm2 squares
    (Courtesy of AMO)

    mr-UVCur21



    print version ›››    print version