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micro resist technology GmbH
Produkt-Highlights 2009:
ma-N 440 und ma-N 490 » High-viscosity resists for conventional pattern transfer and for PVD/ lift-off processes
The pattern profile of the resists of the ma-N 400 series is tunable - from nearly vertical to undercut to a different, defined extend. This makes the ma-N 400 resists, besides for the conventional pattern transfer processes, e.g. etching or electroplating, ideally suited for pattern transfer processes using physical vapour deposition (PVD) and lift-off. With their sensitivity to i-line or broadband exposure, aqueous alkaline development, no post exposure bake and easy removal they show a broad process window and are easy to handle.
Using the high-viscosity ma-N 400 resists - the ma-N 440 and ma-N 490 - resist thicknesses of up to 10 µm (standard process) can be patterned and used for creating metal patterns. Aspect ratios of up to 2 are achievable.
The generation of a multilayer contact system of Ti/ Pt/Au by sputtering and the manufacture of a small solder bump of Au/Sn by evaporation followed by a reflow process on a TiW pad were successfully demonstrated [Voigt] as possible applications. The developed cost effective method to achieve small lead-free solder bump depots for flip chip bonding is applicable on 200 mm silicon wafers.
A. Voigt, M. Heinrich, K. Hauck, R. Mientus, G. Gruetzner, M. Toepper, O. Ehrmann „A single layer negative tone lift-off photo resists for patterning magnetron sputtered Ti/ Pt/ Au contact system and for solder bumps“, Microelectronic Engineering 78-79 (2005) 503-508
PerMX3000 – high performance permanent dry film resists for MEMS and WLP applications
micro resist technology offers DuPont´s PerMX3000, an innovative corrosion-free, negative tone, photoimageable epoxy resist for MEMS applications, e.g. for cavities, such as SAW filters (frame, roofing) or CMOS sensors (frame, bonding), as well as for Wafer Level Packaging.
Resist properties:
»» more - DuPont dry film resists
»» PerMX3000 Data sheet
New method for ultra fast removal of epoxy resists
Within a co-operation of the European research network UFER (= Ultra Fast Epoxy Removal), micro resist technology developed a dry chemical method for the removal of epoxy photoresists which is ready for our customers now. This highly efficient and reproducible method improves the application of crosslinked organic materials like SU-8 in MEMS technology and packaging. The critical handicap of its removal has been solved successfully .
UFER = Ultra Fast Epoxy Removal
micro resist technology recommends the epoxy resist removal tool STP 2020 from R3T in Taufkirchen near Munich. In this tool, the Traveling Wave Reactor Source TWR 2000 from R3T is used as a remote source of a cooled high-density flow of chemical radicals which react very effectively with the polymers to be removed from substrates. This reactions are spatially separated from the plasma, which allows processing at low temperatures. Further important application characteristics of the STP 2020 etching tool are:
The etching tool STP 2020 can be used in several fields of application:
MEMS
Semiconductor
Further applications
Materials for UV-based nanoimprint lithography
micro resist technology provides a complete solution of materials for UV-based nanoimprint
lithography: the UV-NIL polymer for pattern transfer and the transparent stamp material for the cost-efficient replication of
your master mould.
1. UV-NIL polymer mr-UVCur21 for pattern transfer
The UV-curable polymer mr-UVCur21 has outstanding nanoimprint properties. Its excellent flow behaviour and its short UV curing time enable high pattern fidelity and short cycle times. As an etch mask for nanopatterns transfer mr UV-Cur21 can be used for the fabrication of hard disk drives (patternd media), photonic crystals, optical meta materials, or other nano-optical systems.
2. Ormostamp for transparent working stamps in nanoimprint processes Ormostamp is an inorganic-organic hybrid polymer for the cost-efficient fabrication of transparent working stamps. In a UV
moulding process working stamps with micrometer and nanometer patterns can be prepared. They are excellently suited for the use in UV-based and/or thermal nanoimprint lithography.
Reflow of ma-P 1275 for 3D patterning
ma-P 1275, previously presented here as high viscosity positive tone photoresist for microsystems technology (Product Highlights 2008), was applied for 3D patterning. To give an example reflowed ma-P 1275 patterns were used for pattern transfer by RIE or/ and moulding with UV curable hybrid polymers Ormostamp and Ormocomp (micro resist technology GmbH).
The shape of the reflowed patterns is controlled by the initial pattern dimensions and the reflow temperature. Half spheres can be obtained with a height : diameter ratio of 1 : 3 in the initial pillars. A reflow temperature of 140 °C shows the best results. Gaps of 4 µm between e.g. 60 µm or 120 µm diameter pillars are resolved, and the patterns do not intermix during the described reflow process on Si substrates.
The easy removability of ma-P 1275 facilitates moulding with UV curable Ormostamp; ma P 1275 residues can be removed by rinsing the cured Ormostamp patterns with acetone.
Reflowing ma-P 1275 is an excellent approach to fabricate moulds/ masks for 3D patterns such as microlens arrays.
Product-Highlights 2008:
Ormostamp – A novel hybrid polymer for fabricating of transparent working stamps for imprint lithography
Ormostamp is a new inorganic-organic hybrid polymer for the cost-efficient fabrication of transparent working stamps. In a UV moulding process working stamps with micron and nano size structures can be prepared. They are excellently suited for the use in UV-based and/ or thermal nanoimprint lithography. At least 60 imprints could be achieved with a working stamp made of Ormostamp so far.
The fabrication of Ormostamp stamps is easy, cost-efficient and takes short time, since only small amounts of material are required for the process. Moreover, conventional lithographic equipment can be used. After UV exposure, hard bake and the application of the anti-sticking layer the stamp is ready-to-use for UV-based and thermal imprinting.
Ormoprime08 – New one-component adhesion promoter for ORMOCER®s
A new adhesion promoter for hybrid polymers, Ormoprime08, has been provided to the market since August 2008. The one-component system is applied by spin-coating, it forms homogeneous films of about 130 nm thickness and effectuates excellent adhesion to glass, quartz and silicon substrates.
ma-N 1400 – Negative photoresist series
for conventional pattern transfer and for PVD and lift-off processes
Fig.: ma-N 1440, film thickness 4 µm, undercut 2.5 µm
The pattern profile of the resists of the ma-N 1400 series is tunable - from nearly vertical to undercut
to a different, defined extend. This makes the ma-N 1400 resists ideally suited especially for pattern transfer
processes using physical vapour deposition (PVD) and lift-off. With their sensitivity to i-line or broadband
exposure, aqueous alkaline development, no post exposure bake and easy removal they show a broad process window
and are easy to handle. The resists of the ma-N 1400 series exhibit a higher thermal stability than those of
the ma-N 400 series.
Since earlier this year ma-N 1440 has been available, a new resist in the ma-N 1400 series with a higher
viscosity for a thickness range of 3 to 7 µm.
mr-I 7000E and mr-I 8000E - Polymers for thermal nanoimprint lithography
The two thermoplastic polymers mr-I 7000E and mr-I 8000E (Tg 60 °C and 115 °C) can be applied in nanoimprint processes for the production of nanopatterns in the fields of data storage, LED, display, or nano and micro optical devices. Their beneficial nanoimprint behaviour and high plasma etch resistance particularly enables short cycle times, excellent pattern transfer fidelity, and low resolution down to 50 nm.
mr-I T85 for biological applications and lab-on-a-chip
The series mr-I T85 is a functional imprint polymer particularly suitable for lab-on-a-chip systems, biological applications and micro-optical components. It is characterised by exceptionally high chemical stability, high resistance to acids and solvents, as well as excellent UV and optical transparency. mr-I T85 is compatible to conventional photoresists. Its beneficial flow behaviour allows simultaneous imprinting of nanometer and micrometer patterns.
ma-P 1275 and ma-P 1275 HV – Thick Positive Photoresists
Versatile high viscosity positive photoresists for microsystems technology
ma-P 1275 and ma-P 1275 HV are positive photoresists for film thicknesses of up to 60 µm designed for electroplating structures in microsystems technology and excellently suited for the use as etch mask. With their sensitivity to i-line, g-line or broadband exposure, aqueous alkaline development, no post exposure bake and easy removal they show a broad process window and are easy to handle.
