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micro resist technology GmbH

We are distributor of DuPont dry film photoresists:

Resist	Application	Filmt- hickness	Permanent/ Removable	Developer
MX Series MX 5000, MX 5000c, MXAdvance100,	Multipurpose, e.g.Via formation, plating and protection, RDL etching	10–100 µm	Removable	Spray development, 0.75% K2CO3 (mr-D 4000/ 75)
WBR 2000 Series	Solder bumping by electro- plating or stencil printing, Copper pillars	50, 75, 100, 120 µm	Removable	Spray- development, 1 % K2CO3 (mr-D 4000/ 100)
PerMX 3000 Series	Multipurpose, permanent for MEMS applications, e.g.SAW (frame, roofing), CMOS sensors (frame, bonding), WLP (RDL dielectric, wafers bonding)	20, 50 µm	Permanent	Immersion development, PGMEA, (mr-Dev 600)
WPR 1000 Series	Multipurpose coloured resist, for permanent applications	50, 75, 100 µm	Permanent	Spray development, 0.85% Na2CO3 anhydrous or 1% Na2CO3 monohydrate

Documents:

MX Series »Processing guidelines«

MX5000

MX5000c

MX Advance 100 Series »Processing guidelines«

MX Advance 100

WBR 2000 Series »Processing guidelines«

WBR 2000 Series

PerMX 3000 Series »Data sheet«

PerMX 3000 Series

WPR 1000 Series »Processing guidelines« and properties of the cured material

WPR 1000 Series »Processing guidelines«

WPR 1000 Series »properties of the cured material«

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We also offer ready-to-use diluted developers for these resists.

Please find more information on the various types of dry film photoresists for the Advanced Packaging Lithography here »

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Additional information at: www.dupont.com

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