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micro resist technology GmbH
The most frequently asked questions about our products:
1) What are Hybrid Polymers?
They are organic-inorganic hybrid materials. They contain two networks
joined together: an inorganic (in our case Si-O-Si based) and an
organic one. ORMOCER® is a trademark of the Fraunhofer-Gesellschaft
zur Förderung der angewandten Forschung e.V. München.
2) Do you have processing guidelines for each product series?
You will get the processing guidelines with the delivery of the product.
Please contact the corresponding product manager, if you need further processing
details before.
3) Do the Hybrid Polymers pass the Telcordia test?
The Hybrid polymers pass the Telcordia GR-1221_CORE test. After
1000 h at 85 oC and 85 % relative humidity no changes can be visually
evaluated within the patterned material. Moreover, no delamination
or other adhesion
failures appear.
4) What are the Tg(glass transition temperature)
values for the Hybrid Polymers?
The fully UV-cured Hybrid polymer products are three-dimensionally
cross-linked, so that no glass transition occurs. Hybrid polymers are
duromeric.
5) Is it possible to increase the adhesion of the OMOCER®s on
substrates like glass, fused silica, or Si?
The Hybrid polymers adhesion to substrates like glass,
fused silica, or Si surface can be increased by substrate pre-treatment
using OrmoPrime. (OrmoPrime composition and use – see processing guidelines)
6) Do I have to apply a release agent on used templates?
We strongly recommend to apply a release agent on the mould or stamp
in order to generate a high adhesion contrast between mould or stamp
and substrate. It is advisable to pre-treat the lithography mask, even if
only a proximity
lithography process is done. The formed anti-sticking layer (ASL)
prevents defects caused by sticking of the Hybrid polymers
on the mould/stamp. The most common release agent for silicon or
silicon dioxide is “F13-TCS” (1H,1H,2H,2H-perfluorooctyl-trichlorosilane,
CAS number [78560-45-9], available from common specialty chemicals suppliers).
The processing of F13-TCS for Si and SiO2 moulds
is described in: M. Beck et al., Improving Stamps for 10 nm Level Wafer
Scale Nanoimprint Lithography, Microel. Eng. 61 62 (2002), 441 448; H.
Schift et al., Controlled
co-evaporation of silanes for nanoimprint stamps, Nanotechnology 16 (2005),
S171 S175.
7) Is it possible to skip the prebake step?
The prebake step can be applied for removing possible air inclusions and improving
the uniformity of the Ormocer layer after the coating process.
The prebake is necessary when Hybrid polymer diluted by a solvent is processed.
Please note: Hybrid polymer does not harden during the prebake step and is still viscous thereafter!
® Registered trademark of the Fraunhofergesellschaft zur Förderung der Angewandten Forschung in Deutschland e.V.
